SLVSLJ6A May   2026  – September 2026 TCA9849

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (Global)
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 Reset Timing Requirements
    8. 5.8 Switching Characteristics
  7. 6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 RESET Input
      2. 8.4.2 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 Device Address
      3. 8.5.3 Bus Transactions
        1. 8.5.3.1 Writes
        2. 8.5.3.2 Reads
      4. 8.5.4 Control Register
      5. 8.5.5 RESET Input
      6. 8.5.6 Power-On Reset
        1. 8.5.6.1 Software Reset
        2. 8.5.6.2 Device ID
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-On Reset Requirements
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TCA984x UNIT
PW (TSSOP) RUM (WQFN)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 113.3 68.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.1 54.3 °C/W
RθJB Junction-to-board thermal resistance 71.2 43.9 °C/W
ψJT Junction-to-top characterization parameter 9.8 7.6 °C/W
ψJB Junction-to-board characterization parameter 70.8 44 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 28.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.