SLVSLW4 August   2026 SN74UVP1G04

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  8. 6 Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Feature Description
      1. 7.1.1 Balanced CMOS Push-Pull Outputs
      2. 7.1.2 Standard CMOS Inputs
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

8.4.2 Layout Example

SN74UVP1G04 Example Trace Corners for Improved Signal Integrity Figure 8-2 Example Trace Corners for Improved Signal Integrity
SN74UVP1G04 Example Bypass Capacitor Placement for TSSOP and Similar PackagesFigure 8-3 Example Bypass Capacitor Placement for TSSOP and Similar Packages
SN74UVP1G04 Example Bypass Capacitor Placement for SOT, SC70 and Similar PackagesFigure 8-5 Example Bypass Capacitor Placement for SOT, SC70 and Similar Packages
SN74UVP1G04 Example Bypass Capacitor Placement for WQFN and Similar PackagesFigure 8-4 Example Bypass Capacitor Placement for WQFN and Similar Packages
SN74UVP1G04 Example Damping Resistor Placement for Improved Signal Integrity Figure 8-6 Example Damping Resistor Placement for Improved Signal Integrity