SLVUCC9 September   2022 TLV61070A

 

  1.   TLV61070AEVM-095 Evaluation Module
  2.   Trademarks
  3. 1Introduction
    1. 1.1 Performance
    2. 1.2 Modification
    3. 1.3 Input Capacitor
    4. 1.4 Feedforward Capacitor
  4. 2Setup
    1. 2.1 Input/Output Connector Descriptions
  5. 3Schematic and Bill of Materials
    1. 3.1 Schematic
    2. 3.2 Bill of Materials
  6. 4Board Layout

Board Layout

The PCB of the TLV61070AEVM has four layers. Figure 4-1 and Figure 4-4 illustrate top and bottom side PCB layout. The two inner layers are ground plane helping improve the thermal performance.

GUID-20211109-SS0I-MGMQ-5JLX-0H3SJBGDLHRQ-low.gifFigure 4-1 TLV61070AEVM-095 Top-Side Layout

GUID-20211109-SS0I-KDFD-HST0-R9P8RVPWHJC7-low.gifFigure 4-2 TLV61070AEVM-095 Inner Layer 1 Layout
GUID-20211109-SS0I-X6VW-ZWML-WNPQMZDNKQ5W-low.gifFigure 4-3 TLV61070AEVM-095 Inner Layer 2 Layout
GUID-20211109-SS0I-H3BF-9CSQ-3SS8KVBD827C-low.gifFigure 4-4 TLV61070AEVM-095 Bottom-Side Layout