SLVUE11 August   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Jumper Information
    3. 2.3 Test Points
    4. 2.4 Best Practices
  7. 3Implementation Results
    1. 3.1 Startup
    2. 3.2 Shutdown
    3. 3.3 Charge Pump Operation
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Compliance Information
    1. 5.1 Compliance and Certifications
  10. 6Additional Information
    1. 6.1 Trademarks
  11. 7Related Documentation

4.2 PCB Layouts

TPS7H1302EVM-CVAL Top SilkscreenFigure 4-3 Top Silkscreen.
TPS7H1302EVM-CVAL Top Solder MaskFigure 4-4 Top Solder Mask.
TPS7H1302EVM-CVAL Top LayerFigure 4-5 Top Layer.
TPS7H1302EVM-CVAL Bottom LayerFigure 4-6 Bottom Layer.
TPS7H1302EVM-CVAL Bottom Solder MaskFigure 4-7 Bottom Solder Mask.
TPS7H1302EVM-CVAL Bottom SilkscreenFigure 4-8 Bottom Silkscreen.
TPS7H1302EVM-CVAL Drill DrawingFigure 4-9 Drill Drawing.