SLVUE78 September   2026

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
  9. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  10. 4Device and Documentation Support
    1. 4.1 Device Support
      1. 4.1.1 Development Support
    2. 4.2 Documentation Support
      1. 4.2.1 Related Documentation
        1. 4.2.1.1 PCB Layout Resources
        2. 4.2.1.2 Thermal Design Resources
  11. 5Additional Information
    1. 5.1 Trademarks

3.2 PCB Layouts

Figure 3-2 through Figure 3-7 show the design of the LMR70410-Q1 EVM using a four-layer PCB with 2oz copper thickness.

LMR70410QEVM PCB (Top View) Figure 3-2 PCB (Top View)
LMR70410QEVM PCB (Bottom View) Figure 3-3 PCB (Bottom View)
LMR70410QEVM Top Copper (Top View) Figure 3-4 Top Copper (Top View)
LMR70410QEVM Layer 2 Copper (Top View) Figure 3-5 Layer 2 Copper (Top View)
LMR70410QEVM Layer 3 Copper (Top View) Figure 3-6 Layer 3 Copper (Top View)
LMR70410QEVM Bottom Copper (Top View) Figure 3-7 Bottom Copper (Top View)