SNAA343A March   2021  – May 2021 TPL5110-Q1

 

  1. 1Overview
  2. 2Functional Safety Failure In Time (FIT) Rates
  3. 3Failure Mode Distribution (FMD)
  4. 4Pin Failure Mode Analysis (Pin FMA)
  5. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TPL5110-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
Class Failure Effects
A Potential device damage that affects functionality
B No device damage, but loss of functionality
C No device damage, but performance degradation
D No device damage, no impact to functionality or performance

Figure 4-1 shows the TPL5110-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TPL5110-Q1 data sheet.

GUID-50CCBF0D-C890-4EF6-AA4F-C901A494E168-low.gifFigure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Device used within the Recommended Operating Ratings and the Absolute Maximum Ratings found in the TPL5110-Q1 data sheet.
  • Configuration as a timer as shown in the Typical Application found in the TPL5110-Q1 data sheet.

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class

VDD

1

Device may not power on. No current flow.

B

GND

2

Typically tied to GND.

D

DELAY/M_DRV

3

May default to minimum delay value of 100ms.

C

DONE

4

DRV output forced to minimum duty cycle, remaining low TIP - 50ms, and returning high for 50ms.

C

DRV

5

Output is forced low.

B

EN/ONE_SHOT

6

Forces one-shot operation.

C

Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class

VDD

1

No functionality.

B

GND

2

Device will not power on. No current flow.

B

DELAY/M_DRV

3

Device may not complete initialization. May default to maximum time interval.

B

DONE

4

DRV output will have minimum duty cycle, remaining low TIP - 50ms, and returning high for 50ms.

C

DRV

5

No output.

B

EN/ONE_SHOT

6

May operate in timer or one-shot mode.

C

Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class

VDD

1

GND

Device may not power on. No current flow.

B

GND

2

DELAY/M_DRV

May force time interval to minimum.

C

DELAY/M_DRV

3

DONE

May force manual MOSFET power on.

B

DONE

4

DRV

DRV output will have minimum duty cycle, remaining low TIP - 50ms, and returning high for 50ms.

C

DRV

5

EN/ONE_SHOT

May operate in timer or one-shot mode.

C

EN/ONE_SHOT

6

VDD

Forces timer operation.

C

Table 4-5 Pin FMA for Device Pins Short-Circuited to VDD
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class

VDD

1

Typically tied to VDD.

D

GND

2

Device may not power on. No current flow.

B

DELAY/MC_DRV

3

Device may not complete initialization. DRV output may be forced low.

B

DONE

4

Impacts DRV output pulse width for one period.

C

DRV

5

Output is forced high.

B

EN/ONE_SHOT

6

Forces timer operation.

C