SNAS870C July   2025  – August 2026 LMR60410-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Undervoltage Lockout
      2. 7.3.2 Soft Start and Recovery from Dropout
      3. 7.3.3 Frequency Selection With RT
      4. 7.3.4 MODE/SYNC Pin Control
      5. 7.3.5 Output Voltage Selection
      6. 7.3.6 Current Limit
      7. 7.3.7 Hiccup Mode
      8. 7.3.8 Power-Good Function
      9. 7.3.9 Spread Spectrum
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Continuous Conduction Mode (CCM)
        2. 7.4.2.2 Auto Mode Operation - Light Load Operation
        3. 7.4.2.3 FPWM Operation - Light Load Operation
        4. 7.4.2.4 Minimum On-Time
        5. 7.4.2.5 Dropout
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency Selection
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bootstrap Capacitor (CBOOT) Selection
        6. 8.2.2.6 FB Voltage Divider for Adjustable Versions
          1. 8.2.2.6.1 Feedforward Capacitor (CFF) Selection
        7. 8.2.2.7 RPU - PGOOD Pullup Resistor
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Plane Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.3 Best Design Practices

  • Do not exceed the Absolute Maximum Ratings.
  • Do not exceed the ESD Ratings.
  • Do not exceed the Recommended Operating Conditions.
  • Do not allow the EN, RT, MODE/SYNC input to float.
  • Do not allow the output voltage to exceed the input voltage, nor go below ground.
  • Do follow all of the guidelines and suggestions found in this data sheet, before committing your design to production. TI Application Engineers are ready to help critique your design and PCB layout to help make your project a success.
  • Do refer to the helpful documents found in Section 9.2.1.