To aid in our goal of reducing the physical and thermal distance between the sensor and critical components, the new TMP114 and TMP144 temperature sensors from TI are available in a small-footprint, and ultra-thin, 0.15mm height YMT package. This makes them uniquely suited for under-component temperature sensing applications. These DSBGA package devices have only a thin-backside coating between them and the die, allowing for extremely low R_ϴJC(top) thermal resistances. This means that heat can conduct easily through the top of the package to the sensing element located in the silicon die. In terms of overall footprint, the TMP114 and TMP144 temperature sensors are only 0.758mm x 0.758mm and 0.76mm x 0.96mm respectively, ensuring they are small enough to easily place and route.

Figure 4-2 TMP144 and TMP144 YMT Package Drawing