SNLA382 March   2021 DS250DF230

 

  1.   Trademarks
  2. 1Introduction
  3. 2QFN Pinout and Schematic Considerations
  4. 3RTV (QFN) Layout Considerations
    1. 3.1 RTV (QFN) Footprint Recommendations
    2. 3.2 RTV (QFN) Layout Example

2 QFN Pinout and Schematic Considerations

The following is a detailed comparison of differences between BGA and QFN packages.

GUID-20201209-CA0I-422Z-JJ1F-HK1VBSHGC1JH-low.gifFigure 2-1 ZLS (BGA) 36-Package Pinout
GUID-20201209-CA0I-WKVQ-CMKP-0G85KKJXHQ1P-low.gifFigure 2-2 RTV (QFN) 32-Package Pinout

There are no differences from a schematic and pinout standpoint in terms of the number or availability of the high-speed, control/status, and power pins. The only difference in pin count is the number of GND connections. There are 12 balls on the BGA package routed to GND. There are 8 pins and a large thermal pad on the QFN package that are internally routed to GND.