SNLS757D June   2024  – October 2025 TUSB2E221

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Variants
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parametric Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 USB 2.0
      2. 8.3.2 eUSB2
      3. 8.3.3 Cross MUX
    4. 8.4 Device Functional Modes
      1. 8.4.1  Repeater Mode
      2. 8.4.2  Power-Down Mode
      3. 8.4.3  UART Mode
      4. 8.4.4  Auto-Resume ECR
      5. 8.4.5  L2 State Interrupt Modes
      6. 8.4.6  Attach Detect Interrupt Mode
      7. 8.4.7  GPIO Mode
        1. 8.4.7.1 EQ0 as GPIO0
        2. 8.4.7.2 EQ1 as GPIO1
        3. 8.4.7.3 EQ2/INT as GPIO2
      8. 8.4.8  CROSS
      9. 8.4.9  USB 2.0 High-Speed HOST Disconnect Detection
      10. 8.4.10 Frame Based Low Power Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Target Interface
      2. 8.5.2 Register Access Protocol (RAP)
  10. 9 Register Map
    1. 9.1 TUSB2E221 Registers
  11. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Dual Port System
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 eUSB PHY Settings Recommendation
      3. 10.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Up Reset
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Example Layout
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DPA, DNA, DPB, DNB, HS Driver Switching Characteristics
THSR Rise Time (10% - 90%) USB 2.0 Spec Section 7.1.2 (1), U_HS_TX_SLEW_RATE_Px Setting 11, ideal 45Ω to GND loads on DP and DN, Pre-emphasis disabled. 530 625 740 ps
THSF Fall Time (10% - 90%) USB 2.0 Spec Section 7.1.2 (1), U_HS_TX_SLEW_RATE_Px Setting 11, ideal 45Ω to GND loads on DP and DN, Pre-emphasis disabled. 530 625 740 ps
DPA, DNA, DPB, DNB, FS Driver Switching Characteristics
TFR Rise Time (10% - 90%) USB 2.0 Spec Figure 7-8; Figure 7-9 (1) 4 20 ns
TFF Fall Time (10% - 90%) USB 2.0 Spec Figure 7-8; Figure 7-9 (1) 4 20 ns
TFRFM (TFR/TFM) USB 2.0 Spec 7.1.2 (1), Excluding the first transition from the Idle state 90 111.1 %
DPA, DNA, DPB , DNB, LS Driver Switching Characteristics
TLR Rise Time (10% - 90%) USB 2.0 Spec Figure 7-8 (1) 75 300 ns
TLF Fall Time (10% - 90%) USB 2.0 Spec Figure 7-8 (1) 75 300 ns
eDP0, eDN0, eDP1, eDN1, HS Driver Switching Characteristics
TEHSRF Rise/Fall Time (20% - 80%)  eUSB2 Spec Section 7.2.1 (2), 
ideal 80Ω Rx differential termination 
E_HS_TX_SLEW_RATE_Px Setting = 01		 355 440 525 ps
TEHSRF_MM Transmit rise/fall mismatch eUSB2 Spec Section 7.2.1 (2), 
Rise/fall mismatch = absolute delta of (rise – fall time) / (average of rise and fall time).		 25 %
eDP0, eDN0, eDP1, eDN1, LS/FS Driver Switching Characteristics
TERF Rise/Fall Time (10% - 90%)  eUSB2 Spec Section 7.2.1 (2) 2 6 ns
TERF_MM Transmit rise/fall mismatch eUSB2 Spec Section 7.2.1 (2) 25 %
I2C (SDA)
Tr Rise Time (STD) Bus Speed = 100kHz, CL= 200pF, RPU = 4kΩ, IOL = approximately 1mA 600 ns
Tr Rise Time (FM) Bus Speed = 400kHz, CL= 200pF, RPU = 2.2kΩ, IOL = approximately 2mA 180 ns
Tr Rise Time (FM+) Bus Speed = 1MHz, CL= 10pF, RPU = 1kΩ, IOL = approximately 4mA 72 ns
Tr Rise Time (STD) Bus Speed = 100kHz, CL= 200pF, RPU = 4kΩ, IOL = approximately 2mA 1000 ns
Tr Rise Time (FM) Bus Speed = 400kHz, CL= 200pF, RPU = 1kΩ, IOL = approximately 8mA 300 ns
Tr Rise Time (FM+) Bus Speed = 1MHz, CL= 50pF, RPU = 1kΩ, IOL = approximately 4mA 120 ns
Tf Fall Time (STD) Bus Speed = 100kHz, CL= 200pF, RPU = 2.2kΩ, IOL = approximately 4mA 106.5 ns
Tf Fall Time (FM) Bus Speed = 400kHz, CL= 200pF, RPU = 1kΩ, IOL = approximately 8mA 106.5 ns
Tf Fall Time (FM+) Bus Speed = 1MHz, CL= 90pF, RPU = 1kΩ, IOL = approximately 8mA 81.5 ns
Tf Fall Time (STD) Bus Speed = 100kHz, CL= 10pF, RPU = 4kΩ, , IOL = approximately 2mA 6.5 ns
Tf Fall Time (FM) Bus Speed = 400kHz, CL= 10pF, RPU = 2.2kΩ, IOL = approximately 4mA 6.5 ns
Tf Fall Time (FM+) Bus Speed = 1MHz, CL= 10pF, RPU = 1kΩ, IOL = approximately 8mA 6.5 ns
(1) USB 2.0 Promoter Group 2000, USB 2.0 Specification USB 2.0 Promoter Group
(2) USB Implementers Forum (2018). Embedded USB2 (eUSB2) Physical Layer Supplement to the USB Revision 2.0 Specification, Rev. 1.2 USB Implementers Forum