SNVA213B May   2007  – February 2022 LM2745

 

  1.   Trademarks
  2. Introduction
  3. Specifics Of The Board
  4. Feature Options
  5. Specification Summary
  6. Performance Characteristics – Efficiency
  7. Switch Node Voltage and Output Voltage Ripple
  8. Load Transient Response
  9. Bill of Materials
  10. PCB Layout
  11. 10Revision History

PCB Layout

GUID-2D7DC112-9353-4B03-BA67-36B49429A6FD-low.pngFigure 9-1 Top Silkscreen
GUID-51FEA17E-5DE3-4A7D-8D2C-E9B5BA7071C9-low.pngFigure 9-2 Top Copper Layer
GUID-CC024462-7D14-4A9C-8A82-CFAFD6806BB2-low.pngFigure 9-3 Bottom Silkscreen
GUID-C61FC39D-382E-48D5-810F-8D0AA9FCFA63-low.pngFigure 9-4 Bottom Copper Layer
GUID-7DCC947A-30B8-4709-B4F0-EF725C88E95F-low.pngFigure 9-5 Internal Layer-1 (GND Copper)
GUID-F040EF39-8C6F-44A2-AE31-20B4B4F8840B-low.pngFigure 9-6 Internal Layer-2 (GND Copper)