SNVS007I September   1998  – June 2025 LM2674

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics – 3.3-V Version
    6. 5.6  Electrical Characteristics – 5-V Version
    7. 5.7  Electrical Characteristics – 12-V Version
    8. 5.8  Electrical Characteristics – Adjustable Voltage Version
    9. 5.9  Electrical Characteristics – All Output Voltage Versions
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Adjustable Output Voltage
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Fixed Output Voltage Typical Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 7.2.1.2.2 Inductor Selection (L1)
          3. 7.2.1.2.3 Output Capacitor Selection (COUT)
          4. 7.2.1.2.4 Catch Diode Selection (D1)
          5. 7.2.1.2.5 Input Capacitor (CIN)
          6. 7.2.1.2.6 Boost Capacitor (CB)
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Adjustable Output Voltage Typical Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Programming Output Voltage
          2. 7.2.2.2.2 Inductor Selection (L1)
          3. 7.2.2.2.3 Output Capacitor Selection (COUT)
          4. 7.2.2.2.4 Catch Diode Selection (D1)
          5. 7.2.2.2.5 Input Capacitor (CIN)
          6. 7.2.2.2.6 Boost Capacitor (CB)
        3. 7.2.2.3 Application Curves
      3. 7.2.3 Typical Application for All Output Voltage Versions
        1. 7.2.3.1 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 WSON Package Devices
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design with WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

LM2674 D or P Package, 8-Pin SOIC or PDIP (Top View)Figure 4-1 D or P Package, 8-Pin SOIC or PDIP (Top View)
LM2674 NHN Package, 16-Pin WSON (Top View)
Connect DAP to pin 11 and 12.
Figure 4-2 NHN Package, 16-Pin WSON (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME SOIC, PDIP WSON
CB 1 1 I Bootstrap capacitor connection for high-side driver. Connect a high-quality, 10-nF capacitor from CB to VSW Pin.
FB 4 8 I Feedback sense input pin. Connect to the midpoint of feedback divider to set VOUT for ADJ version or connect this pin directly to the output capacitor for a fixed output version.
ON/ OFF 5 9 I Enable input to the voltage regulator. High = ON and low = OFF. Pull this pin high or float to enable the regulator
VSW 8 15, 16 O Source pin of the internal high-side FET. This is a switching node. Attached this pin to an inductor and the cathode of the external diode
GND 6 11, 12 — Power ground pins. Connect to system ground. Ground pins of CIN and COUT. Path to CIN must be as short as possible.
VIN 7 14 I Supply input pin to collector pin of high-side FET. Connect to power supply and input bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and GND must be as short as possible.
NC 2, 3 2, 3, 4, 5, 6, 7, 10, 13 — No connect pins
DAP — — — All DAP, tab, and paddle connections are at ground potential and must be connected to system ground to allow for correct thermal and electrical performance.
(1) I = input, O = output