SNVSB28A December   2017  – April 2026 LM25575-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High Voltage Start-Up Regulator
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown and Stand-by Mode
      2. 6.4.2 Error Amplifier and PWM Comparator
      3. 6.4.3 Ramp Generator
      4. 6.4.4 Maximum Duty Cycle and Input Drop-out Voltage
      5. 6.4.5 Current Limit
      6. 6.4.6 Soft Start
      7. 6.4.7 Boost Pin
      8. 6.4.8 Thermal Protection
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 BIas Power Dissipation Reduction
    2. 7.2 Typical Application
      1. 7.2.1 Typical Schematic for High Frequency (1MHz) Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1  Custom Design With WEBENCH® Tools
        2. 7.2.3.2  R3 (RT)
        3. 7.2.3.3  L1
        4. 7.2.3.4  C3 (CRAMP)
        5. 7.2.3.5  C9, C10
        6. 7.2.3.6  D1
        7. 7.2.3.7  C1, C2
        8. 7.2.3.8  C8
        9. 7.2.3.9  C7
        10. 7.2.3.10 C4
        11. 7.2.3.11 R5, R6
        12. 7.2.3.12 R1, R2, C12
        13. 7.2.3.13 R7, C11
        14. 7.2.3.14 R4, C5, C6
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Layout and Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Developmental Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)LM25575-Q1UNIT
PWP (HTSSOP)
16 PINS
R θJAJunction-to-ambient thermal resistance 38.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance21.8°C/W
R θJBJunction-to-board thermal resistance 15.6°C/W
ψ JTJunction-to-top characterization parameter 0.5°C/W
ψ JBJunction-to-board characterization parameter 16.4°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance 1.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application note.