SNVU856 November   2023 LMR36500

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Additional Images
    2. 2.2 Power Requirements
    3. 2.3 Setup
  7. 3Implementation Results
    1. 3.1 Evaluation Setup
    2. 3.2 Performance Data and Results
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Additional Information
    1. 5.1 Trademarks

PCB Layouts

GUID-20230501-SS0I-8MSK-GZBJ-XJDPHGVVQFH8-low.svg Figure 4-2 PCB Top Layer
GUID-20230501-SS0I-KRZM-VQ7M-17KS389RMSFB-low.svg Figure 4-3 PCB Ground Layer (Directly below top layer)
GUID-20230501-SS0I-PWRB-PWHH-8TPJ2P2BV1T9-low.svg Figure 4-4 PCB Signal Layer
GUID-20230501-SS0I-9WPH-XDW8-STVNGNDWGNFW-low.svg Figure 4-5 PCB Bottom Layer