1 Introduction

The electronics industry is making a significant investment in surface mount technology (SMT), driven by the potential for cost savings and increased efficiency. However, current carrier tape technology has a limitation - it typically only accommodates one row of components per product, with a standard packing quantity of 500 to 3,000 units in one reel. In a mass production, this means that the reel needs to be replaced up to 10 times a day, resulting in significant productivity losses, increased warehouse space, higher transportation costs, and more industrial waste. To address this challenge, TI's new technology references the design of trays, introducing a matrix-style arrangement to tape and reel that increases packing density by 200%. In this article, TI explores how its Ecoship™ technology and Enviropack™ tape and reel solutions can help SMT assembly houses overcome these challenges. By leveraging this revolutionary packing solution, our customers can mount TI's packages at a lower cost and ultimately alleviate storage and shipping challenges.

Figure 1-1 Multiple Row Carrier tape, Ecoship Technology and Enviropack Tape and Reel