SSZT361 december   2019 LM53625-Q1 , LM53635-Q1 , LM61440-Q1 , LM61460-Q1 , LM62440-Q1 , LM73606-Q1 , LMR33620-Q1 , LMR33630-Q1 , LMR34206-Q1 , LMR34215-Q1 , LMR36006-Q1 , LMR36015-Q1 , LMR36503-Q1 , LMS3635-Q1 , LMS3655-Q1

 

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    2.     The difference between standard wire-bond QFN and flip-chip packages
    3.     Using pins to optimize heat distribution
    4.     Additional resources
Technical Article

Optimizing Flip-chip IC Thermal Performance in Automotive Designs