SWRA672 May   2020 AWR6843AOP , IWR6843AOP

 

  1.   Thermal Design Guide for Antenna on Package mmWave Sensor
    1.     Trademarks
    2. 1 Introduction
    3. 2 mmWave AoP package
      1. 2.1 Thermal Characteristics of the Package
    4. 3 Salient features of AoP EVM
      1. 3.1 Thermal Challenges in Dissipating the Heat
    5. 4 Techniques for Mitigating the Heat Dissipation
      1. 4.1 Reduce the System Level Thermal Resistance
      2. 4.2 Board Size Scaling
      3. 4.3 Heatsink Options
        1. 4.3.1 Sheet Metal Heat Sink
        2. 4.3.2 Heat Sink Details
        3. 4.3.3 Mounting Options
        4. 4.3.4 Thermal Characteristics With the Sheet-Metal Heatsink
      4. 4.4 Heatsink with fins
        1. 4.4.1 Thermal Characteristics With the Heatsink
    6. 5 PCB based thermal improvements
      1. 5.1 Thermal via array
    7. 6 Application and Demos
    8. 7 Summary
    9. 8 Acknowledgment
    10. 9 References

4.4 Heatsink with fins

Heatsink with fins will provide further improvement in thermal performance for the sensor at the expense of larger surface area and complexity in the heatsink design. Fin configuration provides larger surface area to dissipate the heat. In general, the larger the surface area, the better the heat sinking capabilities. This experiment and measurement were done on one of the older version of AoP board.

Top_side_of_EVM_with_fin_heatsink.pngFigure 14. Top Side of the EVM With Heatsink Mounted
Bottom_side_of_EVM_with_FIN_heatsink.pngFigure 15. Bottom Side of the EVM With Heatsink With the FINS Mounted