SWRU641 March   2026

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Temperature Range
    3. 2.3 Programming, Debug, and Control
      1. 2.3.1 Using a LaunchPad XDS110 Debug Probe
      2. 2.3.2 Using a Generic XDS110 Debug Probe, Including a Separate LaunchPad
    4. 2.4 Interfaces
      1. 2.4.1 XDS110 Interface Connector
      2. 2.4.2 Debug Interface Connector
    5. 2.5 Jumper Information
  9. 3Advanced Use of the LaunchPad Hardware
    1. 3.1 Conducted Measurements / External Antenna
  10. 4Software
    1. 4.1 Software Development
  11. 5Hardware Design Files
    1. 5.1 Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Compliance Information
    1. 6.1 CE Compliance
    2. 6.2 REACH Compliance
    3. 6.3 Waste Electrical and Electronic Equipment (WEEE) Compliance
  13. 7Additional Information
    1. 7.1 Trademarks
  14. 8References

1.3 Specification

The Dual Main BCU EVM is equipped with 2 CC2662R-Q1 devices. These devices are connected via GPIO pins to enable a SPI interface for communication and control. Each wireless MCU device has a dedicated watchdog device TPS3436-Q1 that can be enabled and disabled using a dedicated header per device and can be controlled by its respective wireless MCU device. The board is equipped with a 20-pin connector that allows for interfacing with a XDS110 launch pad (LP) for easy control via USB from a PC. The board allows for manual switching of JTAG and UART lines between wireless MCU devices when interfacing via an XDS110 LP. If an XDS110 LP is not available, each wireless MCU device has a dedicated 10-pin JTAG header that can be used for programming and control. The EVM is equipped with standoffs for powering the board using an external power supply, or can be powered up via the XDS110 connector, or the JTAG headers. All available unused GPIO of each wireless MCU device is routed to a dedicated 26-pin header to allow for custom applications and configurations. Each wireless MCU device utilizes an inverted F antenna for wireless communication and is equipped with an SMA test connector that can be utilized for performing conducted RF measurements. In addition the EVM can support:

  • 1 additional SPI interface
  • 1 additional UART interface for Host MCU communication
  • 1 x I²C
  • 1 x I²S
  • Real-time clock (RTC)
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Four 32-bit or eight 16-bit general-purpose timers