TIDUFF7 October   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6

Features

  • Compact design with highly integrated ICs facilitating a 70mm diameter PCB and a 15mm diameter through hole
  • Supports multiprotocol industrial Ethernet communication and multiprotocol encoder interface
  • Small form factor DRV7167 GaN half-bridge power stage enables high power density and easy PCB layout
  • Precision phase current sense using 1mΩ shunt and the AMC0106M05 functional isolated modulator