TIDUFH6 May   2026

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 48V Smart Actuator Architectures
        1. 2.2.1.1 48V Distribution Architecture
        2. 2.2.1.2 48V and 12V Distribution Architecture
        3. 2.2.1.3 48V and 12V Supplies Architecture
        4. 2.2.1.4 Reference Design Architecture
      2. 2.2.2 Low Power Sleep Mode Architecture
      3. 2.2.3 Bulk Capacitance Estimation
      4. 2.2.4 EMI PI Filter
      5. 2.2.5 Reverse Polarity Protection
      6. 2.2.6 LIN Bus Fault Voltage for 48V Architecture
    3. 2.3 Highlighted Products
      1. 2.3.1 TLIN4029A-Q1
      2. 2.3.2 MSPM0G3507-Q1
      3. 2.3.3 DRV8363-Q1
      4. 2.3.4 LM5168P-Q1
      5. 2.3.5 TPS7B81-Q1
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 Reference Design Hardware and Programming Setup
    2. 3.2 Software
    3. 3.3 Test Setup
    4. 3.4 Test Results
      1. 3.4.1 LIN Remote Wake-Up Timing Analysis
        1. 3.4.1.1 Test Setup
        2. 3.4.1.2 Test Results
      2. 3.4.2 System Sleep Current Analysis
        1. 3.4.2.1 Test Setup
        2. 3.4.2.2 Test Results
      3. 3.4.3 DC Link Voltage Ripple
        1. 3.4.3.1 Test Setup
        2. 3.4.3.2 Test Results
      4. 3.4.4 Thermal Images
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Layout Prints
        2. 4.1.3.2 Gerber Files
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5.     Trademarks
  11. 5About the Author

3.1 Hardware Requirements

This reference design demonstrates proof-of-concept functionality and showcases the exceptional miniaturization capabilities of TI portfolio components within highly constrained form factors. The current implementation prioritizes spatial optimization and functional validation. The design illustrates how TI's advanced semiconductor technologies integrate into compact PCB geometries while maintaining essential performance characteristics. Future design iterations will incorporate comprehensive electromagnetic interference (EMI) optimization strategies and enhanced creepage and clearance considerations to meet stringent automotive compliance standards. This approach allows engineers to first validate the core functionality and feasibility before advancing to full production-ready implementations with complete regulatory compliance.