SNAS826D April   2022  – February 2023 LMK6C , LMK6D , LMK6H , LMK6P

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Ordering Information
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Environmental Compliance
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Thermal Information
    7. 7.7 Electrical Characteristics
    8. 7.8 Timing Diagrams
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Device Output Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bulk Acoustic Wave (BAW)
      2. 9.3.2 Device Block-Level Description
      3. 9.3.3 Function Pin(s)
      4. 9.3.4 Clock Output Interfacing and Termination
      5. 9.3.5 Temperature Stability
      6. 9.3.6 Mechanical Robustness
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 Ensuring Thermal Reliability
        2. 10.4.1.2 Recommended Solder Reflow Profile
      2. 10.4.2 Layout
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High-performance differential and single-ended output Oscillator, supporting any fixed frequency within the below range:
    • LMK6D: 1 to 400 MHz, LVDS output
    • LMK6H: 1 to 400 MHz, HCSL output
    • LMK6P: 1 to 400 MHz, LVPECL output
    • LMK6C: 1 to 200 MHz, LVCMOS output
  • Ultra-low jitter:
    • LMK6D/LMK6H/LMK6P: 100-fs typical / 125-fs maximum RMS jitter at 156.25 MHz (12 kHz to 20 MHz)
    • LMK6C: 350-fs typical / 500-fs maximum RMS jitter at 100 MHz (12 kHz to 20 MHz)
    • LMK6H: PCIe Gen 1 to Gen 6 compliant
  • ±25 ppm total frequency stability inclusive of 10 years aging and all other factors
  • Smallest industry standard DLE and DLF packages
  • Support extended industrial temperature grade:
    • LMK6P/LMK6D/LMK6H: –40°C to 85°C
    • LMK6C: –40°C to 105°C
  • Integrated LDO for robust supply noise immunity:
    • –72 dBc PSRR at 500 kHz ripple
  • Start-up time: < 5 ms
  • Standard frequencies:
    • LVCMOS (MHz): 4, 8.192, 12, 20, 24, 25, 33.333, 40, 50, 60, 65.53, 74.25, 100, 125 and 156.25
    • Differential (MHz): 51.84, 100, 122.88, 125, 148.5, 155.52, 156.25, 161.1328125, 200 and 312.5
  • Device can support any frequency between 1 MHz to 400 MHz. Contact TI representative for any frequency and samples needed