SNVSAZ9 March   2022 LP8764-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1. 5.1 Digital Signal Descriptions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Internal Low Drop-Out Regulators (LDOVINT)
    6. 6.6  BUCK1, BUCK2, BUCK3, and BUCK4 Regulators
    7. 6.7  Reference Generator (REFOUT)
    8. 6.8  Monitoring Functions
    9. 6.9  Clocks, Oscillators, and DPLL
    10. 6.10 Thermal Monitoring and Shutdown
    11. 6.11 System Control Thresholds
    12. 6.12 Current Consumption
    13. 6.13 Digital Input Signal Parameters
    14. 6.14 Digital Output Signal Parameters
    15. 6.15 I/O Pullup and Pulldown Resistance
    16. 6.16 I2C Interface
    17. 6.17 Serial Peripheral Interface (SPI)
      1.      25
  7. Typical Characteristics
  8. Detailed Description
    1. 8.1  Overview
    2. 8.2  Functional Block Diagram
    3. 8.3  Input Voltage Monitor
    4. 8.4  Device State Machine
      1. 8.4.1 Fixed Device Power FSM
        1. 8.4.1.1 Register Resets and EEPROM read at INIT state
      2. 8.4.2 Pre-Configurable Mission States
        1. 8.4.2.1 PFSM Commands
          1. 8.4.2.1.1  REG_WRITE_IMM Command
          2. 8.4.2.1.2  REG_WRITE_MASK_IMM Command
          3. 8.4.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
          4. 8.4.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
          5. 8.4.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
          6. 8.4.2.1.6  REG_WRITE_VOUT_IMM Command
          7. 8.4.2.1.7  REG_WRITE_VCTRL_IMM Command
          8. 8.4.2.1.8  REG_WRITE_MASK_SREG Command
          9. 8.4.2.1.9  SREG_READ_REG Command
          10. 8.4.2.1.10 SREG_WRITE_IMM Command
          11. 8.4.2.1.11 WAIT Command
          12. 8.4.2.1.12 DELAY_IMM Command
          13. 8.4.2.1.13 DELAY_SREG Command
          14. 8.4.2.1.14 TRIG_SET Command
          15. 8.4.2.1.15 TRIG_MASK Command
          16. 8.4.2.1.16 END Command
        2. 8.4.2.2 Configuration Memory Organization and Sequence Execution
        3. 8.4.2.3 Mission State Configuration
        4. 8.4.2.4 Pre-Configured Hardware Transitions
          1. 8.4.2.4.1 ON Requests
          2. 8.4.2.4.2 OFF Requests
            1. 8.4.2.4.2.1 NSLEEP1 and NSLEEP2 Functions
            2. 8.4.2.4.2.2 WKUP1 and WKUP2 Functions
      3. 8.4.3 Error Handling Operations
        1. 8.4.3.1 Power Rail Output Error
        2. 8.4.3.2 Boot BIST Error
        3. 8.4.3.3 Runtime BIST Error
        4. 8.4.3.4 Catastrophic Error
        5. 8.4.3.5 Watchdog (WDOG) Error
        6. 8.4.3.6 Error Signal Monitor (ESM) Error
        7. 8.4.3.7 Warnings
      4. 8.4.4 Device Start-up Timing
      5. 8.4.5 Power Sequences
      6. 8.4.6 First Supply Detection
    5. 8.5  Power Resources
      1. 8.5.1 Buck Regulators
        1. 8.5.1.1 BUCK Regulator Overview
        2. 8.5.1.2 Multi-Phase Operation and Phase-Adding or Shedding
        3. 8.5.1.3 Transition Between PWM and PFM Modes
        4. 8.5.1.4 Spread-Spectrum Mode
        5. 8.5.1.5 Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
        6. 8.5.1.6 BUCK Output Voltage Setting
      2. 8.5.2 Sync Clock Functionality
      3. 8.5.3 Internal Low Dropout Regulator (LDOVINT)
    6. 8.6  Residual Voltage Checking
    7. 8.7  Output Voltage Monitor and PGOOD Generation
    8. 8.8  General-Purpose I/Os (GPIO Pins)
    9. 8.9  Thermal Monitoring
      1. 8.9.1 Thermal Warning Function
      2. 8.9.2 Thermal Shutdown
    10. 8.10 Interrupts
    11. 8.11 Control Interfaces
      1. 8.11.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 8.11.2 I2C-Compatible Interface
        1. 8.11.2.1 Data Validity
        2. 8.11.2.2 Start and Stop Conditions
        3. 8.11.2.3 Transferring Data
        4. 8.11.2.4 Auto-Increment Feature
      3. 8.11.3 Serial Peripheral Interface (SPI)
    12. 8.12 Multi-PMIC Synchronization
      1. 8.12.1 SPMI Interface System Setup
      2. 8.12.2 Transmission Protocol and CRC
        1. 8.12.2.1 Operation with Transmission Errors
        2. 8.12.2.2 Transmitted Information
      3. 8.12.3 SPMI Target Device Communication to SPMI Controller Device
        1. 8.12.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
      4. 8.12.4 SPMI-BIST Overview
        1. 8.12.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
        2. 8.12.4.2 Periodic Checking of the SPMI
        3. 8.12.4.3 SPMI Message Priorities
    13. 8.13 NVM Configurable Registers
      1. 8.13.1 Register Page Partitioning
      2. 8.13.2 CRC Protection for Configuration, Control, and Test Registers
      3. 8.13.3 CRC Protection for User Registers
      4. 8.13.4 Register Write Protection
        1. 8.13.4.1 ESM and WDOG Configuration Registers
        2. 8.13.4.2 User Registers
    14. 8.14 Watchdog (WD)
      1. 8.14.1 Watchdog Fail Counter and Status
      2. 8.14.2 Watchdog Start-Up and Configuration
      3. 8.14.3 MCU to Watchdog Synchronization
      4. 8.14.4 Watchdog Disable Function
      5. 8.14.5 Watchdog Sequence
      6. 8.14.6 Watchdog Trigger Mode
      7. 8.14.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
      8.      121
      9. 8.14.8 Watchdog Question-Answer Mode
        1. 8.14.8.1 Watchdog Q&A Related Definitions
        2. 8.14.8.2 Question Generation
        3. 8.14.8.3 Answer Comparison
          1. 8.14.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
          2. 8.14.8.3.2 Watchdog Sequence Events and Status Updates
          3. 8.14.8.3.3 Watchdog Q&A Sequence Scenarios
    15. 8.15 Error Signal Monitor (ESM)
      1. 8.15.1 ESM Error-Handling Procedure
      2. 8.15.2 Level Mode
      3.      132
      4. 8.15.3 PWM Mode
        1. 8.15.3.1 Good-Events and Bad-Events
        2. 8.15.3.2 ESM Error-Counter
          1. 8.15.3.2.1 ESM Start-Up in PWM Mode
        3. 8.15.3.3 ESM Flow Chart and Timing Diagrams in PWM Mode
        4.       138
    16. 8.16 Register Map
      1. 8.16.1 LP8764x_map Registers
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Buck Inductor Selection
        2. 9.2.1.2 Buck Input Capacitor Selection
        3. 9.2.1.3 Buck Output Capacitor Selection
        4. 9.2.1.4 LDO Output Capacitor Selection
        5. 9.2.1.5 VCCA Supply Filtering Components
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Voltage Scaling Precautions
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RQK|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • AEC-Q100 Qualified with the following results:
    • Input voltage: 2.8 V to 5.5 V
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD classification Level 2
    • Device CDM ESD classification Level C4B
  • Functional Safety-Compliant
    • Developed for functional safety applications
    • Documentation available to aid ISO 26262 system design up to ASIL-D
    • Documentation available to aid IEC 61508 system design up to SIL-3
    • Systematic capability up to ASIL-D
    • Hardware integrity up to ASIL-D
    • Windowed voltage and over-current monitors
    • Watchdog with selectable trigger / Q&A mode
    • Level or PWM error signal monitoring (ESM)
    • Thermal monitoring with high temperature warning and thermal shutdown
    • Bit-integrity (CRC) error detection on configuration registers and non-volatile memory
  • 4 high-efficiency step-down DC/DC converters:
    • Output voltage: 0.3 V to 3.34 V (0.3 V to 1.9 V for multi-phase outputs)
    • Maximum output current: 5 A per phase, up to 20 A with 4-phase configuration
    • Programmable output voltage slew-rate: 0.5 mV/µs to 33 mV/µs
    • Switching frequency: 2.2 MHz or 4.4 MHz
  • 10 configurable general purpose I/O (GPIO)
  • SPMI interface for multi-PMIC synchronization
  • Input overvoltage monitor (OVP) and undervoltage lockout (UVLO)

GUID-C9AE9CC8-4684-45EA-BF47-E5BD4F5A7DEA-low.gif Simplified Schematic