SBOSA77 March   2023 OPA928

ADVANCE INFORMATION  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4.     Thermal Information
    5. 6.4 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Guard Buffer
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Capacitive Load and Stability
      4. 7.3.4 EMI Rejection
      5. 7.3.5 Common-Mode Voltage Range
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Contamination Considerations
      2. 8.1.2 Guarding Considerations
      3. 8.1.3 Humidity Considerations
      4. 8.1.4 Dielectric Relaxation
    2. 8.2 Typical Applications
      1. 8.2.1 High-Impedance (Hi-Z) Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Transimpedance Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power-Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 TI Reference Designs
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Ultra-low input bias current:
    • 20 fA (tested max) at 25ºC and 85ºC
  • Low noise:
    • 0.05 fA/√Hz at 0.1 Hz
    • 15 nV/√Hz at 1 kHz
  • High dc precision:
    • ±5 µV input offset voltage
    • ±0.1 µV/°C offset voltage drift
  • Wide bandwidth: 2.5-MHz GBW
  • Low quiescent current: 275 µA
  • EMI and RFI filtered inputs
  • High precision guard buffer
  • Wide supply: ±2.25 V to ±8 V, 4.5 V to 16 V
  • Rail-to-rail input and output
  • High capacitive load drive capability: 1 nF
  • Operating temperature range: –40ºC to +125ºC
  • Industry standard package:
    • 8-pin SOIC