SLLSG24A November   2024  – May 2025 TCAN2845-Q1 , TCAN2847-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device Comparison Table
  6. 5Pin Configuration and Functions
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 CAN Transceiver Physical Layer Standards:
      2. 6.1.2 LIN Transceiver Physical Layer Standards
      3. 6.1.3 EMC Requirements:
      4. 6.1.4 Conformance Test Requirements:
      5. 6.1.5 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Data Sheet

TCAN284x-Q1 Automotive CAN FD and LIN System Basis Chip (SBC) with Wake Inputs and High-side Switches