SLASF52 August   2022 TMUXHS221

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  High-Speed Performance Parameters
    7. 6.7  Switching Characteristics
    8. 6.8  Typical Characteristics – S-parameters
    9. 6.9  Typical Characteristics – Eye Diagrams
    10. 6.10 Typical Characteristics – RON
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable and Power Savings
      2. 7.3.2 Data Line Biasing
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Routing Debug Signals to USB Port
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Systems Examples
      1. 8.3.1 PCIe Clock Muxing
      2. 8.3.2 USB-C SBU Muxing
      3. 8.3.3 Switching USB Port
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information
    2. 12.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NKG|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Compatible to USB 2.0 and eUSB2 LS, FS, and HS physical layers
  • Analog switch that can support most CMOS or differential signals up to 3.3 V and 3 Gbps
  • Data pins are 5 V tolerant
  • Low RON of 3 Ω at VI/O = 0.2 V
  • High –3 dB BW of 3.3 GHz
  • Excellent for USB 2.0 or eUSB2 HS signals
    at 240 MHz:
    • Insertion loss = –0.4 dB
    • Return loss = –22 dB
    • Off isolation / cross talk = –32 dB
  • Minimal vertical and horizontal USB 2.0
    HS eye attenuation
  • 3.3 V supply voltage
  • 1.8 or 3.3 V control logic inputs
  • Extended industrial temperature range
    of –40 to 125°C
  • Small 10-pin 1.4 mm × 1.8 mm, UQFN package