CD4011A

ACTIVE

Military 4-ch, 2-input, 3-V to 12-V NAND gates

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Product details

Parameters

Technology Family CD4000 Supply voltage (Min) (V) 3 Supply voltage (Max) (V) 12 IOL (Max) (mA) 0.62 IOH (Max) (mA) -0.75 Input type Standard CMOS Output type Push-Pull Rating Military Operating temperature range (C) -55 to 125 open-in-new Find other NAND gate

Package | Pins | Size

CDIP (J) 14 130 mm² 19.94 x 6.73 CDIP SB (JD) 14 open-in-new Find other NAND gate

Features

  • Quiescent current specified to 15V
  • Maximum input leakage of 1 uA at 15 V (full package-temperature range)
  • 1-V noise margin (full package-temperature range)

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Description

The TI-CD4011A, CD4012A, and CD4023A NAND gates provide the system designer with direct implementation of the NAND function and supplement the existing family of CMOS gates

These types are supplied in 14-lead hermetic dual-in-line ceramic packages (D and F suffixes), 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), and in chip form (H suffix).

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet CMOS NAND Gates datasheet Nov. 15, 2001
Technical articles How to keep your motor running safely Jun. 04, 2020
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics Dec. 03, 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

CAD/CAE symbols

Package Pins Download
CDIP (J) 14 View options
CDIP SB (JD) 14 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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