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Product details

Parameters

Function Counter Bits (#) 4 Technology Family CD4000 VCC (Min) (V) 3 VCC (Max) (V) 18 Input type CMOS Output type CMOS open-in-new Find other Counter, arithmetic & parity function ICs

Package | Pins | Size

PDIP (N) 16 181 mm² 19.3 x 9.4 SOIC (D) 16 59 mm² 9.9 x 6 SOP (NS) 16 80 mm² 10.2 x 7.8 TSSOP (PW) 16 22 mm² 4.4 x 5 open-in-new Find other Counter, arithmetic & parity function ICs

Features

  • Medium-speed operation -
       6-MHz typical clock frequency at 10 V
  • Positive- or negative-edge triggering
  • Synchronous internal carry propagation
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (over full package-temperature range):
    • 1 V at VDD = 5 V
    • 2 V at VDD = 10 V
    • 2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Standardized, symmetrical output characteristics
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Applications
    • Multistage synchronous counting
    • Multistage ripple counting
    • Frequency dividers

Data sheet acquired from Harris Semiconductor.

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Description

CD4518 Dual BCD Up-Counter and CD4520 Dual Binary Up-Counter each consist of two identical, internally synchronous 4-stage counters. The counter stages are D-type flip-flops having interchangeable CLOCK and ENABLE lines for incrementing on either the positive-going or negative-going transition. For single-unit operation the ENABLE input is maintained high and the counter advances on each positive-going transition of the CLOCK. The counters are cleared by high levels on their RESET lines.

The counter can be cascaded in the ripple mode by connecting Q4 to the enable input of the subsequent counter while the CLOCK input of the latter is held low.

The CD4518B and CD4520B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 8
Type Title Date
* Datasheet CD4518B, CD4520B TYPES datasheet (Rev. D) Mar. 03, 2004
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics Dec. 03, 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

CAD/CAE symbols

Package Pins Download
PDIP (N) 16 View options
SO (NS) 16 View options
SOIC (D) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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