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Product details

Parameters

VDS (V) 25 Power loss (W) 2.4 Ploss current (A) 25 Configuration PowerStage ID, continuous drain current at Ta=25degC (A) 50 Package (mm) SON5x6 PowerStage Operating temperature range (C) -55 to 150 open-in-new Find other Power stages

Package | Pins | Size

LSON-CLIP (DQP) 22 30 mm² 6 x 5 open-in-new Find other Power stages

Features

  • 92% System Efficiency at 30A
  • High Frequency Operation (Up To 2MHz)
  • High Density – SON 5-mm × 6-mm Footprint
  • Low Power Loss 3.4W at 30A
  • Ultra Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3V and 5V PWM Signal Compatible
  • 3-State PWM Input
  • Integrated Bootstrap Diode
  • Pre-Bias Start-Up Protection
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating Halogen Free
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Description

The CSD96371Q5M NexFET Power Stage has an optimized design for use in a high power high density Synchronous Buck converter. This product integrates the gate driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high current, high efficiency, and high speed switching capability in a small 5-mm × 6-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 5
Type Title Date
* Datasheet Synchronous Buck NexFET Power Stage - CSD96371Q5M datasheet Dec. 05, 2012
Technical articles Understanding the benefits of “lead-free” power MOSFETs Feb. 07, 2019
Selection guide Power Management Guide 2018 (Rev. R) Jun. 25, 2018
Technical articles When to use load switches in place of discrete MOSFETs Feb. 03, 2016
Technical articles 48V systems: Driving power MOSFETs efficiently and robustly Oct. 08, 2015

Design & development

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CAD/CAE symbols

Package Pins Download
LSON-CLIP (DQP) 22 View options

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