4-ch, 2-input, 4.5-V to 5.5-V bipolar NAND gates with open-collector outputs
Product details
Parameters
Package | Pins | Size
Features
- Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs
Description
These devices contain four independent 2-input positive-NAND
buffers. They perform the Boolean functions 
or Y = A\ + B\ in positive logic.
The open-collector outputs require pullup resistors to perform
correctly. These outputs may be connected to other open-collector
outputs to implement active-low wired-OR or active-high wired-AND
functions. Open-collector devices are often used to generate high
VOH levels.
The SN54ALS03B is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALS03B is characterized for operation from 0°C to 70°C.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Data sheet | Quadruple 2-Input Positive-NAND Buffers With Open-Collect datasheet (Rev. B) | Dec. 01, 1994 |
| Selection guide | Logic Guide (Rev. AB) | Jun. 12, 2017 | |
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | Dec. 02, 2015 | |
| User guide | LOGIC Pocket Data Book (Rev. B) | Jan. 16, 2007 | |
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 | |
| More literature | Logic Cross-Reference (Rev. A) | Oct. 07, 2003 | |
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | Aug. 29, 2002 | |
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | Aug. 01, 1997 | |
| Application note | Designing With Logic (Rev. C) | Jun. 01, 1997 | |
| Application note | Input and Output Characteristics of Digital Integrated Circuits | Oct. 01, 1996 | |
| Application note | Live Insertion | Oct. 01, 1996 | |
| Application note | Advanced Schottky (ALS and AS) Logic Families | Aug. 01, 1995 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Design tools & simulation
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| PDIP (N) | 14 | View options |
| SOIC (D) | 14 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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