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SN74CBT3253

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5-V, 4:1, 2-channel analog multiplexer with TTL inputs

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5-V, 4:1, 2-channel analog multiplexer with TTL inputs

SN74CBT3253

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Product details

Parameters

Configuration 4:1 Number of channels (#) 2 Ron (Typ) (Ohms) 5 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (C) -40 to 85 Features Supports I2C signals Input/output continuous current (Max) (mA) 128 Rating Catalog open-in-new Find other Analog switches/muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 SSOP (DB) 16 48 mm² 6.2 x 7.8 SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Analog switches/muxes

Features

  • TTL-Compatible Input Levels

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Description

The SN74CBT3253 is a dual 1-of-4 high-speed TTL-compatible FET multiplexer/demultiplexer. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

1OE\, 2OE\, S0, and S1 select the appropriate B output for the A-input data.

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Technical documentation

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Type Title Date
* Datasheet SN74CBT3253 datasheet (Rev. O) Jan. 15, 2004
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Technical articles Is charge injection causing output voltage errors in your industrial control system? Oct. 18, 2018
Selection guides Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes How to Select Little Logic (Rev. A) Jul. 26, 2016
Application notes Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application notes VOLTAGE LEVEL TRANSLATION (SL) - Family Sep. 21, 2011
Solution guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Digital Bus Switch Selection Guide (Rev. A) Nov. 10, 2004
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application notes Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
More literature I2C and Serial Bus Devices Application Clip Jul. 10, 2003
More literature CBT RAID Application Clip Jun. 12, 2003
Application notes Bus FET Switch Solutions for Live Insertion Applications Feb. 07, 2003
Application notes Texas Instruments Little Logic Application Report Nov. 01, 2002
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application notes 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application notes Flexible Voltage-Level Translation With CBT Family Devices Jul. 20, 1999
User guides CBT (5-V) And CBTLV (3.3-V) Bus Switches Data Book (Rev. B) Dec. 01, 1998
Application notes 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A) Apr. 03, 1998
Application notes Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application notes 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B) Mar. 01, 1997
Application notes Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

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Hardware development

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Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


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INTERFACE ADAPTERS Download
document-generic User guide
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Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel
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Reference designs

REFERENCE DESIGNS Download
Ultrasonic Distance Measurement using the TLV320AIC3268 miniDSP CODEC Reference Design
TIDA-00403 — The TIDA-00403 reference design uses off-the-shelf EVMs for ultrasonic distance measurement solutions using algorithms within the TLV320AIC3268 miniDSP. In conjunction with TI’s PurePath Studio design suite, a robust and user configurable ultrasonic distance measurement system can be designed (...)
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CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
SSOP (DB) 16 View options
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
VQFN (RGY) 16 View options

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Videos

Multiplexers & Signal Switches

The New Product Introduction session covers TI's wide portfolio of switches and multiplexers.

Posted: 17-Jan-2020
Duration: 19:32

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