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Automotive 3-line to 8-line decoders/demultiplexer

SN74HCS138-Q1

ACTIVE

Product details

Parameters

Technology Family HCS Function Decoder, Demultiplexer Configuration 3:8 Channels (#) 1 VCC (Min) (V) 2 VCC (Max) (V) 6 Input type Schmitt-Trigger Output type Push-Pull Data rate (Max) (Mbps) 120 ICC (Max) (uA) 2 open-in-new Find other Encoders & decoders

Package | Pins | Size

TSSOP (PW) 16 22 mm² 5 x 4.4 open-in-new Find other Encoders & decoders

Features

  • AEC-Q100 Qualified for automotive applications:
    • Device temperature grade 1: –40°C to +125°C, TA
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classifcation Level C6
  • Wide operating voltage range: 2 V to 6 V
  • Schmitt-trigger inputs allow for slow or noisy input signals
  • Low power consumption
    • Typical ICC of 100 nA
    • Typical input leakage current of ±100 nA
  • ±7.8-mA output drive at 6 V

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Description

The SN74HCS138-Q1 is a three to eight decoder with one standard output strobe (G2) and two active low output strobes (G 1 and G 0). When the outputs are gated by any of the strobe inputs, they are all forced into the high state. When the outputs are not disabled by the strobe inputs, only the selected output is low while all others are high.

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Technical documentation

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Type Title Date
* Datasheet SN74HCS138-Q1 Automotive Qualified 3- to 8-Line Decoder/Demultiplexer datasheet Sep. 09, 2020

Design & development

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Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
EVALUATION BOARD Download
20
Description
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic and translation devices with included dual supply support
  • Board has 9 sections that can be broken apart for a smaller form factor

Design tools & simulation

SIMULATION MODEL Download
SCLM331A.ZIP (51 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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