Packaging information
| Package | Pins VSSOP (DCU) | 8 |
| Operating temperature range (°C) -40 to 125 |
| Package qty | Carrier 250 | SMALL T&R |
Features for the SN74LVC2G241
- Available in the Texas Instruments
NanoFree™ Package - Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 4.1 ns at 3.3 V
- Low Power Consumption, 10-µA Maximum ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C - Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
- Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down
to the VCC Level - Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II - ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
Description for the SN74LVC2G241
This dual buffer and line driver is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G241 device is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
The SN74LVC2G241 device is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is low and 2OE is high, the device passes data from the A inputs to the Y outputs. When 1OE is high and 2OE is low, the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor, and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking or the current-sourcing capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.