SN74LVC2G241

• Available in the Texas Instruments
  NanoFree™ Package
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 4.1 ns at 3.3 V
• Low Power Consumption, 10-µA Maximum I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce)
  <0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
  >2 V at V_CC = 3.3 V, T_A = 25°C
• I_off Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
• Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down
  to the V_CC Level
• Latch-Up Performance Exceeds 100 mA Per
  JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

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This dual buffer and line driver is designed for 1.65-V to 5.5-V V_CC operation.

The SN74LVC2G241 device is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74LVC2G241 device is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is low and 2OE is high, the device passes data from the A inputs to the Y outputs. When 1OE is high and 2OE is low, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup resistor, and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking or the current-sourcing capability of the driver.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.