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Dual Buffer/Driver With 3-State Outputs

SN74LVC2G241

ACTIVE

Product details

Parameters

Technology Family LVC VCC (Min) (V) 1.65 VCC (Max) (V) 5.5 Channels (#) 2 IOL (Max) (mA) 32 ICC (Max) (uA) 10 IOH (Max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Data rate (Mbps) 300 Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

DSBGA (YZP) 8 3 mm² .928 x 1.928 SSOP (DCT) 8 8 mm² 2.95 x 2.80 VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Non-Inverting buffer/driver

Features

  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.1 ns at 3.3 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down
    to the VCC Level
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

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Description

This dual buffer and line driver is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2G241 device is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74LVC2G241 device is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is low and 2OE is high, the device passes data from the A inputs to the Y outputs. When 1OE is high and 2OE is low, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor, and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking or the current-sourcing capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SN74LVC2G241 Dual Buffer and Driver With 3-State Outputs datasheet (Rev. P) Dec. 03, 2018
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note LVC Characterization Information Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
User guide Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
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Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
EVALUATION BOARD Download
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Design tools & simulation

SIMULATION MODEL Download
SCEM291A.ZIP (52 KB) - IBIS Model
SIMULATION MODEL Download
SCEM614.ZIP (7 KB) - PSpice Model
SIMULATION MODEL Download
SCEM614A.ZIP (2 KB) - PSpice Model

Reference designs

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TIDA-01568 — This reference design demonstrates a validated and cost competitive power sequencing solution for an application processor or a high performance control platform. This design supports 5 different voltage rails, optimized with layout space of 12 mm × 12 mm. The design is also capable of (...)
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3D Machine Vision Reference Design Based on AM572x Processor with DLP® Structured Light
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Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design
TIDEP0046 TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy (...)
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TIDEP0047 This TI Design (TIDEP0047) is a reference platform based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC).  This TI Design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and (...)
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CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 8 View options
SM8 (DCT) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

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  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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