Product details

Technology family LVC Number of channels 3 IOL (max) (mA) 32 IOH (max) (mA) 0 Supply current (max) (µA) 10 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
Technology family LVC Number of channels 3 IOL (max) (mA) 32 IOH (max) (mA) 0 Supply current (max) (µA) 10 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
DSBGA (YZP) 8 2.8125 mm² (— mm × — mm) VSSOP (DCU) 8 6.2 mm² (2 mm × 3.1 mm) SSOP (DCT) 8 11.8 mm² (2.95 mm × 4 mm)
  • Available in the Texas Instruments NanoFree Package
  • Supports 5-V VCC Operation
  • Input and Open-Drain Output Accepts Voltages up to 5.5 V
  • Max tpd of 3.4 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

  • Available in the Texas Instruments NanoFree Package
  • Supports 5-V VCC Operation
  • Input and Open-Drain Output Accepts Voltages up to 5.5 V
  • Max tpd of 3.4 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

This triple inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation.

The output of the SN74LVC3G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This triple inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation.

The output of the SN74LVC3G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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* Data sheet Triple Inverter Buffer/Driver With Open-Drain Outputs datasheet (Rev. J) Nov 22, 2013

Design & development

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Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
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Simulation model

SN74LVC3G06 Behavioral SPICE Model

SCEM605.ZIP (7 KB) - PSpice model
Supported products & hardware
Simulation model

SN74LVC3G06 IBIS Model (Rev. A)

SCEM309 (177 KB) - IBIS model
Supported products & hardware
Reference design

TIDA-01406 — Energy Efficient and Isolated CANopen Interface Reference Design

CAN and CANopen are legacy fieldbus protocols used in many applications in factory automation. Whenever high voltage could damage the end equipment there is need for isolation. Today’s smart factories utilize several energy efficient automation nodes. This reference design, which (...)
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
DSBGA (YZP) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian
SSOP (DCT) 8 Ultra Librarian

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