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TPSM63610

ACTIVE

High-density, 36-V input, 1-V to 20-V output, 8-A power module 7.5-mm x 6.5-mm enhanced HotRod™ QFN

Product details

Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Synchronous Buck Type Module Iout (max) (A) 8 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 20 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 2200 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features EMI Tested, Enable, Frequency synchronization, Low Noise, Overcurrent protection, Power good, Spread Spectrum Control mode Peak-Current Duty cycle (max) (%) 98
Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Synchronous Buck Type Module Iout (max) (A) 8 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 20 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 2200 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features EMI Tested, Enable, Frequency synchronization, Low Noise, Overcurrent protection, Power good, Spread Spectrum Control mode Peak-Current Duty cycle (max) (%) 98
B3QFN (RDF) 22 48.75 mm² 7.5 x 6.5
  • Functional Safety-Capable
  • Versatile 36-VIN, 8-AOUT synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Adjustable output voltage from 1 V to 20 V
    • 6.5-mm × 7.5-mm × 4-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • Peak efficiency of 95%+
    • External bias option for improved efficiency
    • Exposed pad for low thermal impedance. EVM θJA = 18.2 °C/W.
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Resistor-adjustable switch-node slew rate
    • Meets CISPR 11 and 32 Class B emissions
  • Designed for scalable power supplies
    • Pin compatible with the TPSM63608 (36 V, 6 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63610 with the WEBENCH Power Designer
  • Functional Safety-Capable
  • Versatile 36-VIN, 8-AOUT synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Adjustable output voltage from 1 V to 20 V
    • 6.5-mm × 7.5-mm × 4-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • Peak efficiency of 95%+
    • External bias option for improved efficiency
    • Exposed pad for low thermal impedance. EVM θJA = 18.2 °C/W.
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Resistor-adjustable switch-node slew rate
    • Meets CISPR 11 and 32 Class B emissions
  • Designed for scalable power supplies
    • Pin compatible with the TPSM63608 (36 V, 6 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63610 with the WEBENCH Power Designer

Deriving from a family of synchronous buck modules, the TPSM63610 is a highly integrated 36-V, 8-A DC/DC design that combines power MOSFETs, a shielded inductor, and passives in an enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 20 V, the TPSM63610 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total design requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63610 device offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum for improved EMI. Along with integrated VCC, bootstrap and input capacitors for increased reliability and higher density. The device can be configured for constant switching frequency over the full load current range (FPWM), or variable frequency (PFM) for higher light load efficiency. Including a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

Deriving from a family of synchronous buck modules, the TPSM63610 is a highly integrated 36-V, 8-A DC/DC design that combines power MOSFETs, a shielded inductor, and passives in an enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 20 V, the TPSM63610 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total design requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63610 device offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum for improved EMI. Along with integrated VCC, bootstrap and input capacitors for increased reliability and higher density. The device can be configured for constant switching frequency over the full load current range (FPWM), or variable frequency (PFM) for higher light load efficiency. Including a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

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Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TPSM63610EVM — TPSM63610 evaluation board for 36-V input, 1-V to 20-V, 8-A output, buck power module

This evaluation module (EVM) enables easy evaluation of TPSM63610 power module through the use of jumpers and test points to configure and test the features of the device on-the-fly. In addition to evaluating the electrical performance of the device, this EVM serves as an example for the circuit (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

TPSM63610 PSPICE Transient Model

SLVMDZ4.ZIP (269 KB) - PSpice Model
CAD/CAE symbol

TPSM63610EVM Design Files

SLVRBM6.ZIP (3938 KB)
Calculation tool

TPSM63610-DESIGN-CALC TPSM63610 power module quickstart design tool

The TPSM6310 quick-start calculator is a standalone tool that facilitates and assists the power-supply engineer with the design of a DC/DC buck regulator based on a family of synchronous buck power modules, including TPSM6310, TPSM63610E and TPSM63608. The user can quickly arrive at an optimized (...)

Supported products & hardware

Supported products & hardware

Products
Power modules (integrated inductor)
TPSM63608 High-density, 36-V input, 1-V to 20-V output, 6-A power module in 7.5-mm x 6.5-mm HotRod™ QFN TPSM63610 High-density, 36-V input, 1-V to 20-V output, 8-A power module 7.5-mm x 6.5-mm enhanced HotRod™ QFN TPSM63610E High-density, 36-V input, 1-V to 20-V output, 8-A power module
Package Pins CAD symbols, footprints & 3D models
B3QFN (RDF) 22 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

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Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

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