Product details

Technology Family TWL Applications SDIO, MMC, UART Audio, SD Card Rating Catalog Operating temperature range (C) -40 to 85
Technology Family TWL Applications SDIO, MMC, UART Audio, SD Card Rating Catalog Operating temperature range (C) -40 to 85
DSBGA (YFF) 49 0 mm² 2.8 x 2.8
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
  • Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility
    Gap Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)

  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
  • Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility
    Gap Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)

The TWL1200 is an 19-bit voltage translator specifically designed to seamlessly bridge the

1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). It is optimized for SDIO, UART, and audio functions. The TWL1200 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200 enables system designers to easily interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.

The TWL1200 is offered in both 48-ball 0.5-mm ball grid array (BGA) and 49-bump 0.4-mm wafer chip scale package (WCSP) packages. Low static power consumption and small package size make the TWL1200 an ideal choice for mobile-phone applications.

The TWL1200 is an 19-bit voltage translator specifically designed to seamlessly bridge the

1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). It is optimized for SDIO, UART, and audio functions. The TWL1200 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200 enables system designers to easily interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.

The TWL1200 is offered in both 48-ball 0.5-mm ball grid array (BGA) and 49-bump 0.4-mm wafer chip scale package (WCSP) packages. Low static power consumption and small package size make the TWL1200 an ideal choice for mobile-phone applications.

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Technical documentation

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Type Title Date
* Data sheet SDIO, UART, and Audio Voltage-Translation Transceiver datasheet (Rev. A) 12 Nov 2009
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
Application note TWL1200 PCB Design Guidelines 06 Jul 2009

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

TWL1200 IBIS Model

SLLM073.ZIP (1043 KB) - IBIS Model
Package Pins Download
DSBGA (YFF) 49 View options

Ordering & quality

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