ADC12D1600RF

ACTIVE

Product details

Sample rate (max) (Msps) 1600, 3200 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2700 Features Ultra High Speed Rating Catalog Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3880 Architecture Folding Interpolating SNR (dB) 59 ENOB (Bits) 9.4 SFDR (dB) 75 Operating temperature range (°C) -40 to 85 Input buffer Yes
Sample rate (max) (Msps) 1600, 3200 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2700 Features Ultra High Speed Rating Catalog Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3880 Architecture Folding Interpolating SNR (dB) 59 ENOB (Bits) 9.4 SFDR (dB) 75 Operating temperature range (°C) -40 to 85 Input buffer Yes
PBGA (NXA) 292 729 mm² (27 mm × 27 mm)
  • Excellent Noise and Linearity up to and Above fIN =
    2.7 GHz
  • Configurable to Either 3.2 or 2 GSPS Interleaved
    or 1600 or 1000 MSPS Dual ADC
  • New DESCLKIQ Mode for High Bandwidth, High
    Sampling Rate Apps
  • Pin-Compatible With ADC10D1x00, ADC12D1x00
  • AutoSync Feature for Multi-Chip Synchronization
  • Internally Terminated, Buffered, Differential Analog
    Inputs
  • Interleaved Timing Automatic and Manual Skew
    Adjust
  • Test Patterns at Output for System Debug
  • Time Stamp Feature to Capture External Trigger
  • Programmable Gain, Offset, and tAD Adjust
    Feature
  • 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
  • Key Specifications
    • Resolution 12 Bits
    • Interleaved 3.2- and 2-GSPS ADC
      • IMD3 (Fin = 2.7 GHz at –13 dBFS) –63.7/–73
        dBFS (Typical)
      • IMD3 (Fin = 2.7 GHz at –16 dBFS) –66.7/–85
        dBFS (Typical)
      • Noise Floor –154.6/–154 dBm/Hz (Typical)
      • Power 3.94/3.42 W (Typical)
    • Dual 1600/1000 MSPS ADC, Fin = 498 MHz
      • ENOB 9.2/9.4 Bits (Typical)
      • SNR 58.2/58.8 dB (Typical)
      • SFDR 66.7/71.9 dBc (Typical)
      • Power per Channel 1.97/1.71 W (Typical)
  • Excellent Noise and Linearity up to and Above fIN =
    2.7 GHz
  • Configurable to Either 3.2 or 2 GSPS Interleaved
    or 1600 or 1000 MSPS Dual ADC
  • New DESCLKIQ Mode for High Bandwidth, High
    Sampling Rate Apps
  • Pin-Compatible With ADC10D1x00, ADC12D1x00
  • AutoSync Feature for Multi-Chip Synchronization
  • Internally Terminated, Buffered, Differential Analog
    Inputs
  • Interleaved Timing Automatic and Manual Skew
    Adjust
  • Test Patterns at Output for System Debug
  • Time Stamp Feature to Capture External Trigger
  • Programmable Gain, Offset, and tAD Adjust
    Feature
  • 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
  • Key Specifications
    • Resolution 12 Bits
    • Interleaved 3.2- and 2-GSPS ADC
      • IMD3 (Fin = 2.7 GHz at –13 dBFS) –63.7/–73
        dBFS (Typical)
      • IMD3 (Fin = 2.7 GHz at –16 dBFS) –66.7/–85
        dBFS (Typical)
      • Noise Floor –154.6/–154 dBm/Hz (Typical)
      • Power 3.94/3.42 W (Typical)
    • Dual 1600/1000 MSPS ADC, Fin = 498 MHz
      • ENOB 9.2/9.4 Bits (Typical)
      • SNR 58.2/58.8 dB (Typical)
      • SFDR 66.7/71.9 dBc (Typical)
      • Power per Channel 1.97/1.71 W (Typical)

The 12-bit 3.2- and 2-GSPS ADC12D1x00RF is an RF-sampling GSPS ADC that can directly sample input frequencies up to and above 2.7 GHz. The ADC12D1x00RF augments the very large Nyquist zone of TI’s GSPS ADCs with excellent noise and linearity performance at RF frequencies, extending its usable range beyond the 3rd Nyquist zone

The ADC12D1x00RF provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common-mode voltage. The product is packaged in a lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.

The 12-bit 3.2- and 2-GSPS ADC12D1x00RF is an RF-sampling GSPS ADC that can directly sample input frequencies up to and above 2.7 GHz. The ADC12D1x00RF augments the very large Nyquist zone of TI’s GSPS ADCs with excellent noise and linearity performance at RF frequencies, extending its usable range beyond the 3rd Nyquist zone

The ADC12D1x00RF provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common-mode voltage. The product is packaged in a lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.

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Design & development

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Evaluation board

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WaveVision 5 software is part of the WaveVision evaluation system that also includes WaveVision 5 Data Capture Board. The WaveVision 5 system is an easy-to-use data acquisition and analysis tool, designed to help users evaluate Texas Instruments' Signal Path solutions.

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Simulation model

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SNAM014.ZIP (41 KB) - IBIS model
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Reference design

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This reference design is a guide to the schematics and layout for the system designer using a GSPS ADC in their system. Use this reference design along with the datasheet — the datasheet is always the final authority. Also, the ADC1xDxxxx(RF)RB Reference Board provides a useful reference (...)

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Reference design

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This design is intended to help the system designer in understanding tradeoffs and optimizing implementation for driving the Giga-Sample-Per-Second ADC with balun configurations for wideband applications.  The tradeoffs considered include balun construction, insertion loss, dynamic (...)

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Reference design

TIDA-00479 — Optimal Clock Sources for GSPS ADCs Reference Design

The ADC12D1600RFRB reference design provides a platform to demonstrate a high speed digitizer application which incorporates clocking, power management, and signal processing. The reference design utilizes the 1.6 GSPS ADC12D1600RF device, onboard FPGA Xilinx Virtex 4, and high performance clock (...)

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PBGA (NXA) 292 Ultra Librarian

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