Información de empaque
Encapsulado | Pines VSON-CLIP (DQG) | 8 |
Rango de temperatura de funcionamiento (℃) -55 to 150 |
Cant. de paquetes | Transportador 2,500 | LARGE T&R |
Características para CSD16409Q3
- Ultra Low Qg and Qgd
- Low Thermal Resistance
- Avalanche Rated
- Pb Free Terminal Plating
- RoHS Compliant
- Halogen Free
- SON 3.3mm x 3.3mm Plastic Package
- APPLICATIONS
- Point-of-Load Synchronous Buck Converter for Applications
in Networking, Telecom and Computing Systems - Optimized for Control FET Applications
- Point-of-Load Synchronous Buck Converter for Applications
NexFET is a trademark of Texas Instruments.
Descripción de CSD16409Q3
The NexFET™ power MOSFET has been designed to minimize losses in power conversion applications.