Detalles del producto

Product type Amplifiers Die or wafer type Tested Die Rating Military Operating temperature range (°C) -40 to 85
Product type Amplifiers Die or wafer type Tested Die Rating Military Operating temperature range (°C) -40 to 85
DIESALE (Y) See data sheet
  • Typical values unless otherwise noted
  • Low offset voltage: 100µV
  • Ultra-low supply current: 16µA/amplifier
  • Supply range: 4.5V to 15V
  • Ultra-low input bias current: 10fA
  • Output swing within 10mV of supply rail, 100kΩ load
  • Input common-mode includes V−
  • High voltage gain: 140dB
  • Improved latchup immunity
  • Typical values unless otherwise noted
  • Low offset voltage: 100µV
  • Ultra-low supply current: 16µA/amplifier
  • Supply range: 4.5V to 15V
  • Ultra-low input bias current: 10fA
  • Output swing within 10mV of supply rail, 100kΩ load
  • Input common-mode includes V−
  • High voltage gain: 140dB
  • Improved latchup immunity

The LMC6061, LMC6062, and LMC6064 (LMC606x) are precision, low-offset-voltage, micropower operational amplifiers (op amps), capable of precision single-supply operation. Performance characteristics include ultra-low input bias current, high voltage gain, rail-to-rail output swing, and an input common-mode voltage range that includes ground. These features, plus the low power consumption of the op amps, make the LMC606x an excellent choice for battery-powered applications.

Other applications using the LMC606x include precision full-wave rectifiers, integrators, references, sample-and-hold circuits, and true instrumentation amplifiers.

This device is built with TI’s advanced double-poly silicon-gate CMOS process.

For designs that require higher speed, see the LMC608x precision operational amplifiers.

PATENT PENDING

The LMC6061, LMC6062, and LMC6064 (LMC606x) are precision, low-offset-voltage, micropower operational amplifiers (op amps), capable of precision single-supply operation. Performance characteristics include ultra-low input bias current, high voltage gain, rail-to-rail output swing, and an input common-mode voltage range that includes ground. These features, plus the low power consumption of the op amps, make the LMC606x an excellent choice for battery-powered applications.

Other applications using the LMC606x include precision full-wave rectifiers, integrators, references, sample-and-hold circuits, and true instrumentation amplifiers.

This device is built with TI’s advanced double-poly silicon-gate CMOS process.

For designs that require higher speed, see the LMC608x precision operational amplifiers.

PATENT PENDING

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Documentación técnica

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Tipo Título Fecha
* Data sheet LMC606x Precision CMOS, Micropower Operational Amplifiers datasheet (Rev. E) PDF | HTML 21 mar 2025
E-book The Signal e-book: A compendium of blog posts on op amp design topics 28 mar 2017
Application note AN-856 A SPICE Comp Macromodel for CMOS Op Amplifiers (Rev. C) 06 may 2013
Application note Effect of Heavy Loads on Accuracy and Linearity of Op Amp Circuits (Rev. B) 22 abr 2013
More literature Die D/S LMC6062I-MDC-MWC Precision CMOS Dual Micropower Op Amp 10 ene 2013

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

LMC606x PSpice Model (Rev. D)

SNOM189D.ZIP (30 KB) - PSpice Model
Modelo de simulación

LMC606x TINA-TI Reference Design (Rev. B)

SNOM649B.TSC (303 KB) - TINA-TI Reference Design
Modelo de simulación

LMC606x TINA-TI Spice Model (Rev. B)

SNOM648B.ZIP (12 KB) - TINA-TI Spice Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DIESALE (Y)

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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