Información de empaque
| Encapsulado | Pines B1QFN (RKG) | 39 |
| Rango de temperatura de funcionamiento (℃) -40 to 85 |
| Cant. de paquetes | Transportador 500 | LARGE T&R |
Características para LMZ30604
- Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design - 9 mm × 11 mm × 2.8 mm package
- Pin Compatible with LMZ30602 and LMZ30606 - Efficiencies Up To 96%
- Wide-Output Voltage Adjust
0.8 V to 3.6 V, with ±1% Reference Accuracy - Adjustable Switching Frequency
(500 kHz to 2 MHz) - Synchronizes to an External Clock
- Adjustable Slow-Start
- Output Voltage Sequencing / Tracking
- Power Good Output
- Programmable Undervoltage Lockout (UVLO)
- Output Overcurrent Protection
- Over Temperature Protection
- Operating Temperature Range: –40°C to 85°C
- Enhanced Thermal Performance: 12°C/W
- Meets EN55022 Class B Emissions
- Integrated Shielded Inductor - Create a Custom Design Using the LMZ30604 With the WEBENCH® Power Designer
Descripción de LMZ30604
The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.
The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.