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TXS0206A

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TXS0206A MMC, SD Card, Memory Stick™ Voltage-Translation Transceiver

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Data sheet

TXS0206A

ACTIVE
Data sheet Order now

Product details

Bits (#) 4 Data rate (max) (Mbps) 60 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 0.88 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO Features EMI filtering, Edge rate accelerator Technology family TXS Supply current (max) (mA) 0.018 Rating Catalog Operating temperature range (°C) -40 to 85
Bits (#) 4 Data rate (max) (Mbps) 60 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 0.88 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO Features EMI filtering, Edge rate accelerator Technology family TXS Supply current (max) (mA) 0.018 Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 20 3.96 mm² (— mm × — mm)
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
    • Fast Propagation Delay (4.4 ns Maximum
      When Translating Between 1.8 V and 3 V)
  • ESD Protection Exceeds JESD 22
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
    • Fast Propagation Delay (4.4 ns Maximum
      When Translating Between 1.8 V and 3 V)
  • ESD Protection Exceeds JESD 22
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)

The TXS0206A is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards.

The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206A enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.

The TXS0206A is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206A an ideal choice for these applications.

The TXS0206A is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards.

The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206A enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.

The TXS0206A is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206A an ideal choice for these applications.
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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet TXS0206A SD Card Voltage-Translation Transceiver datasheet (Rev. B) PDF | HTML Jan 20, 2016
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML Jul 12, 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML Jul 3, 2024
Selection guide Voltage Translation Buying Guide (Rev. A) Apr 15, 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TXS0206AEVM — TXS0206A Evaluation Module

The TXS0206A EVM was created to allow simplified evaluation and prototyping without the need for full board development. This EVM provides peripheral header style pads for probing and signal connection to each device pin.

User guide: PDF
Supported products & hardware
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Simulation model

TXS0206A IBIS Model

SCEM551.ZIP (367 KB) - IBIS model
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
DSBGA (YFP) 20 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

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