292-pin (NXA) package image

ADC12D1000RFIUT/NOPB 現行

12 位元、雙 1.0-GSPS 或單 2.0-GSPS、射頻取樣類比轉數位轉換器 (ADC)

定價

數量 價格
+

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 SNAG
MSL 等級 / 迴焊峰值 Level-3-250C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:3A001A5A3

封裝資訊

封裝 | 引腳 BGA (NXA) | 292
作業溫度範圍 (°C) -40 to 85
包裝數量 | 運送包裝 40 | JEDEC TRAY (10+1)

ADC12D1000RF 的特色

  • Excellent Noise and Linearity up to and Above fIN =
    2.7 GHz
  • Configurable to Either 3.2 or 2 GSPS Interleaved
    or 1600 or 1000 MSPS Dual ADC
  • New DESCLKIQ Mode for High Bandwidth, High
    Sampling Rate Apps
  • Pin-Compatible With ADC10D1x00, ADC12D1x00
  • AutoSync Feature for Multi-Chip Synchronization
  • Internally Terminated, Buffered, Differential Analog
    Inputs
  • Interleaved Timing Automatic and Manual Skew
    Adjust
  • Test Patterns at Output for System Debug
  • Time Stamp Feature to Capture External Trigger
  • Programmable Gain, Offset, and tAD Adjust
    Feature
  • 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
  • Key Specifications
    • Resolution 12 Bits
    • Interleaved 3.2- and 2-GSPS ADC
      • IMD3 (Fin = 2.7 GHz at –13 dBFS) –63.7/–73
        dBFS (Typical)
      • IMD3 (Fin = 2.7 GHz at –16 dBFS) –66.7/–85
        dBFS (Typical)
      • Noise Floor –154.6/–154 dBm/Hz (Typical)
      • Power 3.94/3.42 W (Typical)
    • Dual 1600/1000 MSPS ADC, Fin = 498 MHz
      • ENOB 9.2/9.4 Bits (Typical)
      • SNR 58.2/58.8 dB (Typical)
      • SFDR 66.7/71.9 dBc (Typical)
      • Power per Channel 1.97/1.71 W (Typical)

ADC12D1000RF 的說明

The 12-bit 3.2- and 2-GSPS ADC12D1x00RF is an RF-sampling GSPS ADC that can directly sample input frequencies up to and above 2.7 GHz. The ADC12D1x00RF augments the very large Nyquist zone of TI’s GSPS ADCs with excellent noise and linearity performance at RF frequencies, extending its usable range beyond the 3rd Nyquist zone

The ADC12D1x00RF provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common-mode voltage. The product is packaged in a lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解