8-pin (D) package image

BUF634AIDR 現行

210 MHz、250mA 高速緩衝器

現行 custom-reels 客製 可提供客製捲盤

定價

數量 價格
+

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-2-260C-1 YEAR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:EAR99

封裝資訊

封裝 | 引腳 SOIC (D) | 8
作業溫度範圍 (°C) -40 to 125
包裝數量 | 運送包裝 2,500 | LARGE T&R

BUF634A 的特色

  • Pin-Selected Bandwidth: 35 MHz to 210 MHz
  • High Output Current: 250 mA
  • Slew Rate: 3750 V/µs
  • Low Quiescent Current: 1.5 mA (35-MHz BW)
  • Wide Supply Range: ±2.25 V to ±18 V
  • Internal Output Current Limit
  • Thermal Shutdown Protection
  • Available in Packages with Thermal Pad
  • Extended Temperature Operation: –40°C to +125°C

BUF634A 的說明

The BUF634A device is a high-performance, high-fidelity, open-loop buffer that is capable of driving 250 mA of output current. The BUF634A is a 36-V device with an adjustable bandwidth of 35 MHz to 210 MHz, which is accomplished by varying the value of an external resistor between the V– and BW pins.

The BUF634A device can be used as a standalone open-loop driver, or used inside the feedback loop of a precision op amp to provide both high-precision and large output current drive with improved capacitive load drive.

For low-power applications, the BUF634A device operates on a 1.5-mA quiescent current with a 250-mA output, 3750-V/µs slew rate, and 35-MHz bandwidth. The device consumes 8.5-mA quiescent current in wide-bandwidth mode with a 210-MHz bandwidth. The BUF634A is fully protected by an internal current limit in its output stage and by thermal shutdown, making the device rugged and easy to use.

The BUF634A device is rated to function over the extended industrial temperature range of –40°C to +125°C. The BUF634A comes in three packages: D (SOIC), DRB (VSON), and DDA (HSOIC). The DRB (VSON) and DDA (HSOIC) packages have excellent thermal performance resulting from the thermal pad on the bottom side. The DRB package comes in a very small form factor of 3.0 mm × 3.0 mm, making the device a very suitable option for portable and size-constrained applications.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解