20-pin (PW) package image

DRV8300NPWR 現行

具有自舉二極體的最大 100-V 簡單 3 相閘極驅動器

現行 custom-reels 客製 可提供客製捲盤
open-in-new 檢視替代方案

定價

數量 價格
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品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-2-260C-1 YEAR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
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其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:EAR99

封裝資訊

封裝 | 引腳 TSSOP (PW) | 20
作業溫度範圍 (°C) -40 to 125
包裝數量 | 運送包裝 3,000 | LARGE T&R

DRV8300 的特色

  • 100-V Three Phase Half-Bridge Gate driver
    • Drives N-Channel MOSFETs (NMOS)
    • Gate Driver Supply (GVDD): 5-20 V
    • MOSFET supply (SHx) support upto 100 V
  • Integrated Bootstrap Diodes (DRV8300D devices)
  • Supports Inverting and Non-Inverting INLx inputs
  • Bootstrap gate drive architecture
    • 750-mA source current
    • 1.5-A sink current
  • Supports up to 15S battery powered applications
  • Low leakage current on SHx pins (<55 µA)
  • Absolute maximum BSTx voltage upto 125-V
  • Supports negative transients upto -22-V on SHx
  • Built-in cross conduction prevention
  • Adjustable deadtime through DT pin for QFN package variants
  • Fixed deadtime insertion of 200 nS for TSSOP package variants
  • Supports 3.3-V and 5-V logic inputs with 20 V Abs max
  • 4 nS typical propogation delay matching
  • Compact QFN and TSSOP packages
  • Efficient system design with Power Blocks
  • Integrated protection features
    • BST undervoltage lockout (BSTUV)
    • GVDD undervoltage (GVDDUV)

DRV8300 的說明

DRV8300 is 100-V three half-bridge gate drivers, capable of driving high-side and low-side N-channel power MOSFETs. The DRV8300D generates the correct gate drive voltages using an integrated bootstrap diode and external capacitor for the high-side MOSFETs. The DRV8300N generates the correct gate drive voltages using an external bootstrap diode and external capacitor for the high-side MOSFETs. GVDD is used to generate gate drive voltage for the low-side MOSFETs. The Gate Drive architecture supports peak up to 750-mA source and 1.5-A sink currents.

The phase pins SHx is able to tolerate the significant negative voltage transients; while high side gate driver supply BSTx and GHx is able to support to higher positive voltage transients (125-V) abs max voltage which improves robustness of the system. Small propagation delay and delay matching specifications minimize the dead-time requirement which further improves efficiency. Undervoltage protection is provided for both low and high side through GVDD and BST undervoltage lockout.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解