180-pin (ALP) package image

IWR6843ARQGALPR 現行

具有整合式封裝天線技術 (AoP) 的單晶片 60-GHz 至 64-GHz 智慧型 mmWave 感測器

現行 custom-reels 客製 可提供客製捲盤

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

IWR6843ARQGALP 現行
包裝數量 | 運送包裝 126 | JEDEC TRAY (5+1)
庫存
數量 | 價格 1ku | +

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 SNAGCU
MSL 等級 / 迴焊峰值 Level-3-260C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:5A991F

封裝資訊

封裝 | 引腳 FCCSP (ALP) | 180
作業溫度範圍 (°C) -40 to 105
包裝數量 | 運送包裝 1,000 | LARGE T&R

IWR6843AOP 的特色

  • FMCW transceiver
    • Integrated 4 receivers and 3 transmitters Antennas-On-Package (AOP)
    • Integrated PLL, transmitter, receiver, Baseband, and ADC
    • 60- to 64-GHz coverage with 4-GHz continuous bandwidth
    • Supports 6-bit phase shifter for TX Beam forming
    • Ultra-accurate chirp engine based on fractional-N PLL
  • Built-in calibration and self-test
    • Arm Cortex-R4F-based radio control system
    • Built-in firmware (ROM)
    • Self-calibrating system across process and temperature
    • Embedded self-monitoring with no host processor involvement on Functional Safety-Compliant devices
  • C674x DSP for advanced signal processing
  • Memory compression
  • Hardware accelerator for FFT, filtering, and CFAR processing
  • Arm-R4F microcontroller for object detection, and interface control
    • Supports autonomous mode (loading user application from QSPI flash memory)
  • Internal memory with ECC
    • 1.75 MB, divided into MSS program RAM (512 KB), MSS data RAM (192 KB), DSP L1 RAM (64KB) and L2 RAM (256 KB), and L3 radar data cube RAM (768 KB)
    • Technical reference manual includes allowed size modifications
  • Device Security (on select part numbers)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-2K) with Key revocation capability
    • Crypto software accelerators - PKA , AES (up to 256 bit), SHA (up to 256 bit), TRNG/DRGB
  • Other interfaces available to user application
    • Up to 6 ADC channels (low sample rate monitoring)
    • Up to 2 SPI ports
    • Up to 2 UARTs
    • 1 CAN-FD interface
    • I2C
    • GPIOs
    • 2 lane LVDS interface for raw ADC data and debug instrumentation
  • Functional Safety-Compliant
    • Developed for functional safety applications
    • Documentation available to aid IEC 61508 functional safety system design up to SIL 3
    • Hardware integrity up to SIL-2
    • Safety-related certification
      • IEC 61508 certified upto SIL 2 by TUV SUD
  • Power management
    • Built-in LDO network for enhanced PSRR
    • I/Os support dual voltage 3.3 V/1.8 V
  • Clock source
    • 40.0 MHz crystal with internal oscillator
    • Supports external oscillator at 40 MHz
    • Supports externally driven clock (square/sine) at 40 MHz
  • Easy hardware design
    • 0.8-mm pitch, 180-pin 15 mm × 15 mm FCBGA package (ALP) for easy assembly and low-cost PCB design
    • Small solution size
  • Operating conditions
    • Junction temp range: –40°C to 105°C

IWR6843AOP 的說明

The IWR6843AOP is an Antenna-on-Package (AOP) device that is an evolution within the single-chip radar device family from Texas Instruments (TI). This device enables unprecedented levels of integration in an extremely small form factor and is an ideal solution for low power, self-monitored, ultra-accurate radar systems in the industrial space. Multiple variants are currently available including Functional Safety-Compliant devices (SIL2) and non-functional safety devices.

It integrates a DSP subsystem, which contains TI’s high-performance C674x DSP for the Radar Signal processing. The device includes a BIST processor subsystem, which is responsible for radio configuration, control, and calibration. Additionally, the device includes a user programmable Arm Cortex-R4F based for automotive interfacing. The Hardware Accelerator block (HWA) can perform radar processing and can offload the DSP in order to execute higher level algorithms. Simple programming model changes can enable a wide variety of sensor applications with the possibility of dynamic reconfiguration for implementing a multimode sensor. Additionally, the device is provided as a complete platform solution including reference hardware design, software drivers, sample configurations, API guide, and user documentation.

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

IWR6843ARQGALP 現行
包裝數量 | 運送包裝 126 | JEDEC TRAY (5+1)
庫存
數量 | 價格 1ku | +

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解