8-pin (DGK) package image

LM358DGKR 現行

雙路、30-V、700-kHz 運算放大器

現行 custom-reels 客製 可提供客製捲盤
open-in-new 檢視替代方案

定價

數量 價格
+

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 SN | NIPDAU
MSL 等級 / 迴焊峰值 Level-1-260C-UNLIM
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:EAR99

封裝資訊

封裝 | 引腳 VSSOP (DGK) | 8
作業溫度範圍 (°C) 0 to 70
包裝數量 | 運送包裝 2,500 | LARGE T&R

LM358 的特色

  • Wide supply range of 3 V to 36 V (B, BA versions)
  • Quiescent current: 300 µA/ch (B, BA versions)
  • Unity-gain bandwidth of 1.2 MHz (B, BA versions)
  • Common-mode input voltage range includes ground, enabling direct sensing near ground
  • 2-mV input offset voltage max. at 25°C (BA version)
  • 3-mV input offset voltage max. at 25°C (A, B versions)
  • Internal RF and EMI filter (B, BA versions)
  • On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

LM358 的說明

The LM358B and LM2904B devices are the next-generation versions of the industry-standard operational amplifiers (op amps) LM358 and LM2904, which include two high-voltage (36 V) op amps. These devices provide outstanding value for cost-sensitive applications, with features including low offset (300 µV, typical), common-mode input range to ground, and high differential input voltage capability.

The LM358B and LM2904B op amps simplify circuit design with enhanced features such as unity-gain stability, lower offset voltage maximum of 3 mV (2 mV maximum for LM358BA and LM2904BA), and lower quiescent current of 300 µA per amplifier (typical). High ESD (2 kV, HBM) and integrated EMI and RF filters enable the LM358B and LM2904B devices to be used in the most rugged, environmentally challenging applications.

The LM358B and LM2904B amplifiers are available in micro-sized packaging, such as the SOT23-8, as well as industry standard packages including SOIC, TSSOP, and VSSOP.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解