封裝資訊
| 封裝 | 引腳 VSSOP (DGK) | 8 |
| 作業溫度範圍 (°C) -40 to 125 |
| 包裝數量 | 運送包裝 1,000 | SMALL T&R |
LMP7702 的特色
- Unless Otherwise Noted,
Typical Values at VS = 5 V - Input Offset Voltage (LMP7701): ±200-µV
(Maximum) - Input Offset Voltage (LMP7702/LMP7704):
±220-µV (Maximum) - Input Bias Current: ±200 fA
- Input Bias Current: ±200 fA
- Input Voltage Noise: 9 nV/√Hz
- CMRR: 130 dB
- Open-Loop Gain: 130 dB
- Temperature Range: –40°C to 125°C
- Unity-Gain Bandwidth: 2.5 MHz
- Supply Current (LMP7701): 715 µA
- Supply Current (LMP7702): 1.5 mA
- Supply Current (LMP7704): 2.9 mA
- Supply Voltage Range: 2.7 V to 12 V
- Rail-to-Rail Input and Output
LMP7702 的說明
The LMP770x are single, dual, and quad low-offset voltage, rail-to-rail input and output precision amplifiers, each with a CMOS input stage and a wide supply voltage range. The LMP770x are part of the LMP™ precision amplifier family and are ideal for sensor interface and other instrumentation applications.
The specified low-offset voltage of less than ±200 µV, along with the specified low input bias current of less than ±1 pA, make the LMP7701 ideal for precision applications. The LMP770x are built using VIP50 technology, which allows the combination of a CMOS input stage and a 12-V common-mode and supply voltage range. This makes the LMP770x ideal for applications where conventional CMOS parts cannot operate under the desired voltage conditions.
The LMP770x each have a rail-to-rail input stage that significantly reduces the CMRR glitch commonly associated with rail-to-rail input amplifiers. This is achieved by trimming both sides of the complimentary input stage, thereby reducing the difference between the NMOS and PMOS offsets. The output of the LMP770x swings within 40 mV of either rail to maximize the signal dynamic range in applications requiring low supply voltage.
The LMP7701 is offered in the space-saving 5-Pin SOT-23 and 8-Pin SOIC package. The LMP7702 is offered in the 8-Pin SOIC and 8-Pin VSSOP package. The quad LMP7704 is offered in the 14-Pin SOIC and 14-Pin TSSOP package. These small packages are ideal solutions for area constrained PC boards and portable electronics.