56-pin (DGG) package image

MSP430FR4133IG56R 現行

具有 16KB FRAM、2KB SRAM、10 位元 ADC、LCD、UART/SPI/I2C、IR 邏輯、定時器的 16 MHz MCU

現行 custom-reels 客製 可提供客製捲盤

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

MSP430FR4133IG56 現行
包裝數量 | 運送包裝 35 | TUBE
庫存
數量 | 價格 1ku | +

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-3-260C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:EAR99

封裝資訊

封裝 | 引腳 TSSOP (DGG) | 56
作業溫度範圍 (°C) -40 to 85
包裝數量 | 運送包裝 2,000 | LARGE T&R

MSP430FR4133 的特色

  • Embedded microcontroller
    • 16-bit RISC architecture up to 16 MHz
    • Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the Section 8.12.1.1)
  • Optimized low-power modes (at 3 V)
    • Active mode: 126 µA/MHz
    • Standby mode: <1 µA with real-time clock (RTC) counter and liquid crystal display (LCD)
    • Shutdown (LPM4.5): 15 nA
  • High-performance analog
    • 10-channel 10-bit analog-to-digital converter (ADC)
      • Internal 1.5-V reference
      • Sample-and-hold 200 ksps
    • Low-power LCD driver
      • Supports up to 4×36- or 8×32-segment LCD configuration
      • On-chip charge pump to keep LCD active in standby mode (LPM3.5)
      • Each LCD pin software configurable as SEG or COM
      • Contrast control from 2.6 V to 3.5 V by 0.06‑V steps
  • Low-power ferroelectric RAM (FRAM)
    • Up to 15.5KB of nonvolatile memory
    • Built-in error correction code (ECC)
    • Configurable write protection
    • Unified memory of program, constants, and storage
    • 1015 write cycle endurance
    • Radiation resistant and nonmagnetic
  • Intelligent digital peripherals
    • IR modulation logic
    • Two 16-bit timers with three capture/compare registers each (Timer_A3)
    • One 16-bit counter-only RTC counter
    • 16-bit cyclic redundancy checker (CRC)
  • Enhanced serial communications
    • Enhanced USCI A (eUSCI_A) supports UART, IrDA, and SPI
    • Enhanced USCI B (eUSCI_B) supports SPI and I2C
  • Clock system (CS)
    • On-chip 32-kHz RC oscillator (REFO)
    • On-chip 16-MHz digitally controlled oscillator (DCO) with frequency-locked loop (FLL)
      • ±1% accuracy with on-chip reference at room temperature
    • On-chip very low-frequency 10-kHz oscillator (VLO)
    • On-chip high-frequency modulation oscillator clock (MODCLK)
    • External 32-kHz crystal oscillator (XT1)
    • Programmable MCLK prescalar of 1 to 128
    • SMCLK derived from MCLK with programmable prescalar of 1, 2, 4, or 8
  • General input/output and pin functionality
    • 60 I/Os on 64-pin package
    • 16 interrupt pins (P1 and P2) can wake MCU from LPMs
    • All I/Os are capacitive touch I/O
  • Development tools and software
  • Family members (also see Section 6)
    • MSP430FR4133: 15KB of program FRAM + 512B of information FRAM + 2KB of RAM
    • MSP430FR4132: 8KB of program FRAM + 512B of information FRAM + 1KB of RAM
    • MSP430FR4131: 4KB of program FRAM + 512B of information FRAM + 512B of RAM
  • Package options
    • 64 pin: LQFP (PM)
    • 56 pin: TSSOP (G56)
    • 48 pin: TSSOP (G48)

MSP430FR4133 的說明

MSP430FR41xx ultra-low-power (ULP) microcontroller family supports low-cost LCD applications that benefit from an integrated 10-bit ADC such as remote controls, thermostats, smart meters, blood glucose monitors, and blood pressure monitors. The MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active mode in less than 10 µs. The architecture, combined with extensive low-power modes, is optimized to achieve extended battery life in portable measurement applications.

The MSP430™ FRAM microcontroller platform combines uniquely embedded ferroelectric random access memory (FRAM) and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatile behavior of flash.

MSP430FR41x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits for the MSP430FR41xx include the MSP-EXP430FR4133 LaunchPad™ development kit and the MSP-TS430PM64D 64-pin target development board. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. MSP430 MCUs are also supported by extensive online collateral, such as our housekeeping example series, MSP Academy training, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User’s Guide .

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

MSP430FR4133IG56 現行
包裝數量 | 運送包裝 35 | TUBE
庫存
數量 | 價格 1ku | +

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解