80-pin (PN) package image

MSP430FR5962IPNR 現行

具 128-KB FRAM、8-KB SRAM、低功耗加速器、AES、12 位元 ADC、DMA 和 76 個 IO 的 16-MHz MCU

現行 custom-reels 客製 可提供客製捲盤

定價

數量 價格
+

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-3-260C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:5A992C

封裝資訊

封裝 | 引腳 LQFP (PN) | 80
作業溫度範圍 (°C) -40 to 85
包裝數量 | 運送包裝 1,000 | LARGE T&R

MSP430FR5962 的特色

  • Embedded microcontroller
    • 16-bit RISC architecture up to 16‑MHz clock
    • Up to 256KB of ferroelectric random access memory (FRAM)
      • Ultra-low-power writes
      • Fast write at 125 ns per word (64KB in 4 ms)
      • Flexible allocation of data and application code in memory
      • 1015 write cycle endurance
      • Radiation resistant and nonmagnetic
    • Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS specifications)
  • Optimized ultra-low-power modes
    • Active mode: 118 µA/MHz
    • Standby with VLO (LPM3): 500 nA
    • Standby with real-time clock (RTC) (LPM3.5): 350 nA (the RTC is clocked by a 3.7-pF crystal)
    • Shutdown (LPM4.5): 45 nA
  • Low-energy accelerator (LEA) for signal processing (MSP430FR599x only)
    • Operation independent of CPU
    • 4KB of RAM shared with CPU
    • Efficient 256-point complex FFT: Up to 40x faster than Arm Cortex-M0+ core
  • Intelligent digital peripherals
    • 32-bit hardware multiplier (MPY)
    • 6-channel internal DMA
    • RTC with calendar and alarm functions
    • Six 16-bit timers with up to seven capture/compare registers each
    • 32- and 16-bit cyclic redundancy check (CRC)
  • High-performance analog
    • 16-channel analog comparator
    • 12-bit analog-to-digital converter (ADC) featuring window comparator, internal reference and sample-and-hold, up to 20 external input channels
  • Multifunction input/output ports
    • All pins support capacitive-touch capability with no need for external components
    • Accessible bit-, byte-, and word-wise (in pairs)
    • Edge-selectable wake from LPM on all ports
    • Programmable pullup and pulldown on all ports
  • Code security and encryption
    • 128- or 256-bit AES security encryption and decryption coprocessor
    • Random number seed for random number generation algorithms
    • IP encapsulation protects memory from external access
  • Enhanced serial communication
    • Up to four eUSCI_A serial communication ports
      • UART with automatic baud-rate detection
      • IrDA encode and decode
    • Up to four eUSCI_B serial communication ports
      • I2C with multiple-slave addressing
    • Hardware UART or I2C bootloader (BSL)
  • Flexible clock system
    • Fixed-frequency DCO with 10 selectable factory-trimmed frequencies
    • Low-power low-frequency internal clock source (VLO)
    • 32-kHz crystals (LFXT)
    • High-frequency crystals (HFXT)
  • Development tools and software (also see Tools and Software)
  • Device Comparison summarizes the available devices

MSP430FR5962 的說明

The MSP430FR599x microcontrollers (MCUs) take low power and performance to the next level with the unique low-energy accelerator (LEA) for digital signal processing. This accelerator delivers 40x the performance of Arm® Cortex®-M0+ MCUs to help developers efficiently process data using complex functions such as FFT, FIR, and matrix multiplication. Implementation requires no DSP expertise with a free optimized DSP Library available. Additionally, with up to 256KB of unified memory with FRAM, these devices offer more space for advanced applications and flexibility for effortless implementation of over-the-air firmware updates.

The MSP ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatile behavior of flash.

MSP430FR599x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits for the MSP430FR599x include the MSP-EXP430FR5994 LaunchPad™ development kit and the MSP-TS430PN80B 80-pin target development board. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer.

For complete module descriptions, see the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User’s Guide .

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解