25-pin (YFF) package image

TPA6166A2YFFT 現行

具有配件偵測功能的 43-mW、立體聲道、類比輸入耳機放大器

現行 custom-reels 客製 可提供客製捲盤

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

TPA6166A2YFFR 現行 custom-reels 客製 可提供客製捲盤
包裝數量 | 運送包裝 3,000 | LARGE T&R
庫存
數量 | 價格 1ku | +

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 SNAGCU
MSL 等級 / 迴焊峰值 Level-1-260C-UNLIM
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:EAR99

封裝資訊

封裝 | 引腳 DSBGA (YFF) | 25
作業溫度範圍 (°C) -40 to 85
包裝數量 | 運送包裝 250 | SMALL T&R

TPA6166A2 的特色

  • Ultra Low-Power, High-Performance DirectPath™ Class-G
    Headphone Amplifier
    • Ground-Centered Output Eliminates DC-Blocking
      Capacitors
    • 30 mW/Ch into 32 Ω / Ch at 1% THD+N
    • –42 dB to +6 dB Volume Control
    • 2.0 µV Output Noise at –42 dB Gain
    • 91-dB PSRR
    • Ground Loop Rejection for Reducing Crosstalk
  • Fully Differential Mic Preamplifier With Variable Gain
    and 3.4-µV Low Noise
    • Integrated AC-Coupling Capacitor
    • Ground Loop Rejection for Reducing Headphone to
      Mic Crosstalk
  • Choice of Two Mic Bias Voltages: 2.0 V and 2.6 V
    • 92-dB PSRR
    • Integrated Programmable Mic Bias Resistor
  • Advanced Accessory Insertion, Removal, and Type Detection
  • Passive Multi-button Support Using 10-Bit SAR ADC
    • Implements Proprietary Scheme to Reduce Error Caused
      by Audio Playback Signal in Presence of Finite Resistance
      on Headset Ground Return Path
  • Integrated Level-4 IEC ESD Protection on Jack Connected
    Pins (on EVM)
  • Ultra Low-Power Chip Shutdown Mode
  • I2C Interface
  • Short-Circuit Protection
  • 0.4-mm Pitch 25-Ball WCSP

TPA6166A2 的說明

The TPA6166A2 single-chip headset interface IC simplifies the challenges of detecting what kind of device an end user has plugged into the headphone jack while delivering excellent audio quality. The device enables smaller end products by integrating a high-performance, low-power DirectPath variable-attenuation class-G stereo headphone amplifier, variable-gain microphone preamplifier with bias with advanced accessory detection circuitry, all in a tiny 5-mm × 5-mm terminal, 0.4-mm pitch WCSP package.

The class-G headphone amplifier maximizes battery life by adjusting the supply voltage of the headphone amplifier based on audio signal level. With 8-µV output noise at 0-dB gain and PSRR of 91 dB, the headphone amplifier provides excellent audio performance. DirectPath eliminates the need for DC-blocking capacitors. The microphone preamplifier has two programmable gains of 12 dB and 24 dB, and 3.4 µV input referred noise.

The microphone bias voltage has two programmable settings of 2 V and 2.6 V. The bias output drives up to 1.2 mA of current, has a low output noise of 2 µV, and 92-dB PSRR, providing excellent rejection of power supply noise in wireless handsets.

The advanced accessory detection algorithm automatically detects six supported accessories and enables or disables internal components.

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

TPA6166A2YFFR 現行 custom-reels 客製 可提供客製捲盤
包裝數量 | 運送包裝 3,000 | LARGE T&R
庫存
數量 | 價格 1ku | +

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解